Chun-Mei Chou

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor with improved quantum efficiency surface structure
- Patent number 12,324,258
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
Information Patent Grant
Semiconductor image-sensing structure
- Patent number 12,302,658
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Lin Chen
Information Patent Grant
Method and system for improving the efficiency of protecting a mult...
- Patent number 12,253,960
- Issue date Mar 18, 2025
- Mediatek Inc.
- Yu-Tien Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microbolometer and method of manufacturing the same
- Patent number 12,241,787
- Issue date Mar 4, 2025
- Hon Hai Precision Industry Co., Ltd.
- Chun-Yuan Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor device
- Patent number 12,243,893
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an image sensor having stress releasing structure
- Patent number 12,224,297
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensor including a layer stack to reduce and/or block the eff...
- Patent number 12,218,160
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image-sensing structure and method for forming the same
- Patent number 12,218,164
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench structure for reduced wafer cracking
- Patent number 12,211,805
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-protrusion transfer gate manufacturing method
- Patent number 12,211,862
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Huei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,191,144
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of making
- Patent number 12,183,753
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorine passivation in a pixel sensor
- Patent number 12,183,751
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer treatment system and method of treating wafer
- Patent number 12,183,550
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic radiation detection method
- Patent number 12,176,361
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Huei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Video device, wireless audio device and method for performing audio...
- Patent number 12,177,595
- Issue date Dec 24, 2024
- Mediatek Inc.
- Chun-Ming Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Increased optical path for long wavelength light by grating structure
- Patent number 12,170,302
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daisy-chain seal ring structure
- Patent number 12,170,234
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,112,953
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding structure and manufacturing method thereof
- Patent number 12,113,042
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for sensing long wavelength light
- Patent number 12,113,086
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing substrate and manufacturing method thereof and probe card
- Patent number 12,108,543
- Issue date Oct 1, 2024
- Hermes Testing Solutions Inc.
- Chiao-Pei Chen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,088,940
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Wei Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor including light shielding layer and patterned dielectr...
- Patent number 12,081,866
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation to mitigate dry etch and/or wet etch fluorine residue
- Patent number 12,068,385
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin Field-Effect transistor and method of forming the same
- Patent number 12,051,626
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structures
- Patent number 12,046,528
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,033,850
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yi Chou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,034,054
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Ting Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grid structure with at least partially angled sidewalls
- Patent number 11,990,488
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE
- Publication number 20250185403
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH METAL-INSULATOR-METAL STORAGE ELEMENTS
- Publication number 20250185389
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang Lu
Information Patent Application
METHOD AND SYSTEM FOR IMPROVING EFFICIENCY OF PROTECTING A MULTI-CO...
- Publication number 20250181523
- Publication date Jun 5, 2025
- MEDIATEK INC.
- Yu-Tien CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PIXEL SENSOR WITH MULTI-PROTRUSION TRANSFER GATE
- Publication number 20250176287
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Huei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20250176297
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Wei Cheng
Information Patent Application
IMAGE SENSOR AND METHOD OF MAKING
- Publication number 20250160019
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lin CHEN
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250151372
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Yi CHOU
Information Patent Application
WAFER CHUCK
- Publication number 20250132183
- Publication date Apr 24, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Chi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE-SENSING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250126912
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HSIEN YANG
Information Patent Application
TRENCH STRUCTURE FOR REDUCED WAFER CRACKING
- Publication number 20250118684
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250120197
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250113539
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Yi CHOU
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250098214
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Wen HSU
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250089325
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087482
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yi CHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD TO REDUCE MG TO SD CAPACITANCE BY AN AIR GAP BETW...
- Publication number 20250072052
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chun Yi CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20250063833
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAISY-CHAIN SEAL RING STRUCTURE
- Publication number 20250062166
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER STACKED CMOS IMAGE SENSOR STRUCTURE
- Publication number 20250008244
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Hsien Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACKED TRANSISTOR PHYSICALLY UNCLONABLE FUNCTION
- Publication number 20240413100
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECRONIC DEVICE WITH POLARIZING MASK STRUCTURE
- Publication number 20240405053
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20240395559
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY
- Publication number 20240395785
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE HOLES FOR PIXEL SENSORS AND METHODS OF FORMING THE SAME
- Publication number 20240387599
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER
- Publication number 20240387146
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORINE PASSIVATION IN A PIXEL SENSOR
- Publication number 20240387574
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING
- Publication number 20240380986
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379611
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240373145
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Wei Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371962
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting CHIU
- H01 - BASIC ELECTRIC ELEMENTS

Chun-Mei Chou

Person

Patents Grantslast 30 patents

Image sensor with improved quantum efficiency surface structure

Semiconductor image-sensing structure

Method and system for improving the efficiency of protecting a mult...

Microbolometer and method of manufacturing the same

Image sensor device

Method of forming an image sensor having stress releasing structure

Pixel sensor including a layer stack to reduce and/or block the eff...

Semiconductor image-sensing structure and method for forming the same

Trench structure for reduced wafer cracking

Multi-protrusion transfer gate manufacturing method

Semiconductor device and manufacturing method thereof

Image sensor and method of making

Fluorine passivation in a pixel sensor

Wafer treatment system and method of treating wafer

Electromagnetic radiation detection method

Video device, wireless audio device and method for performing audio...

Increased optical path for long wavelength light by grating structure

Daisy-chain seal ring structure

Semiconductor devices and methods of manufacturing

Metal bonding structure and manufacturing method thereof

Apparatus and methods for sensing long wavelength light

Testing substrate and manufacturing method thereof and probe card

Semiconductor device and method of manufacture

Image sensor including light shielding layer and patterned dielectr...

Oxidation to mitigate dry etch and/or wet etch fluorine residue

Fin Field-Effect transistor and method of forming the same

Heat dissipation structures

Semiconductor device and manufacturing method thereof

Semiconductor device and method for forming the same

Grid structure with at least partially angled sidewalls

Patents Applicationslast 30 patents

IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE

IMAGE SENSOR WITH METAL-INSULATOR-METAL STORAGE ELEMENTS

METHOD AND SYSTEM FOR IMPROVING EFFICIENCY OF PROTECTING A MULTI-CO...

PIXEL SENSOR WITH MULTI-PROTRUSION TRANSFER GATE

IMAGE SENSOR DEVICE

IMAGE SENSOR AND METHOD OF MAKING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER CHUCK

SEMICONDUCTOR IMAGE-SENSING STRUCTURE AND METHOD FOR FORMING THE SAME

TRENCH STRUCTURE FOR REDUCED WAFER CRACKING

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DEVICE AND METHOD TO REDUCE MG TO SD CAPACITANCE BY AN AIR GAP BETW...

IMAGE SENSOR

DAISY-CHAIN SEAL RING STRUCTURE

MULTI-WAFER STACKED CMOS IMAGE SENSOR STRUCTURE

STACKED TRANSISTOR PHYSICALLY UNCLONABLE FUNCTION

OPTOELECRONIC DEVICE WITH POLARIZING MASK STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY

NANOSCALE HOLES FOR PIXEL SENSORS AND METHODS OF FORMING THE SAME

WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER

FLUORINE PASSIVATION IN A PIXEL SENSOR

IMAGE SENSOR FOR SENSING LED LIGHT WITH REDUCED FLICKERING

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME