Chun Mu

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Saratoga, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Process for forming a direct build-up layer on an encapsulated die...
- Patent number 7,189,596
- Issue date Mar 13, 2007
- Intel Corporation
- Chun Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated core microelectronic package
- Patent number 6,825,063
- Issue date Nov 30, 2004
- Intel Corporation
- Quat T. Vu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip on flex for high performance packaging applications
- Patent number 6,743,664
- Issue date Jun 1, 2004
- Intel Corporation
- Chunlin Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
COF packaged semiconductor
- Patent number 6,737,754
- Issue date May 18, 2004
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct build-up layer on an encapsulated die package
- Patent number 6,271,469
- Issue date Aug 7, 2001
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
COF packaged semiconductor
- Patent number 6,238,954
- Issue date May 29, 2001
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and processes for fabricating moisture resistant chip-on...
- Patent number 6,154,366
- Issue date Nov 28, 2000
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COF packaged semiconductor
- Publication number 20020185745
- Publication date Dec 12, 2002
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS