Chun Sean Lau

Person

Penang, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor storage device including staggered semiconductor memo...
- Patent number 12,324,102
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective enclosure for an electronic device
- Patent number 12,016,111
- Issue date Jun 18, 2024
- Western Digital Technologies, Inc.
- Chun Sean Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package having cover portion with curved surfa...
- Patent number 11,551,991
- Issue date Jan 10, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal relief for through-hole and surface mounting
- Patent number 11,284,502
- Issue date Mar 22, 2022
- Western Digital Technologies, Inc.
- Chun Sean Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to enhance reliability in connection with arrange...
- Patent number 11,264,301
- Issue date Mar 1, 2022
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 11,094,604
- Issue date Aug 17, 2021
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 10,636,722
- Issue date Apr 28, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHOCK ABSORBER ASSEMBLY FOR A PRINTED CIRCUIT BOARD
- Publication number 20240381524
- Publication date Nov 14, 2024
- Western Digital Technologies, Inc.
- MyungJin Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...
- Publication number 20240260194
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ENCLOSURE FOR AN ELECTRONIC DEVICE
- Publication number 20230345614
- Publication date Oct 26, 2023
- Western Digital Technologies, Inc.
- Chun Sean Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING COVER PORTION WITH CURVED SURFA...
- Publication number 20210384099
- Publication date Dec 9, 2021
- Western Digital Technologies, Inc.
- Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL RELIEF FOR THROUGH-HOLE AND SURFACE MOUNTING
- Publication number 20210251068
- Publication date Aug 12, 2021
- Western Digital Technologies, Inc.
- Chun Sean Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method to Enhance Solder Joint Reliability
- Publication number 20200219787
- Publication date Jul 9, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190326194
- Publication date Oct 24, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190096783
- Publication date Mar 28, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS

Chun Sean Lau

Person

Patents Grantslast 30 patents

Semiconductor storage device including staggered semiconductor memo...

Protective enclosure for an electronic device

Semiconductor device package having cover portion with curved surfa...

Thermal relief for through-hole and surface mounting

System and method to enhance reliability in connection with arrange...

System and method to enhance solder joint reliability

System and method to enhance solder joint reliability

Patents Applicationslast 30 patents

SHOCK ABSORBER ASSEMBLY FOR A PRINTED CIRCUIT BOARD

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...

PROTECTIVE ENCLOSURE FOR AN ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE PACKAGE HAVING COVER PORTION WITH CURVED SURFA...

THERMAL RELIEF FOR THROUGH-HOLE AND SURFACE MOUNTING

System and Method to Enhance Solder Joint Reliability

SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY

SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY