Chun-Te Yu

Person

Yunlin County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor packages
- Patent number 12,224,276
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test method for delay circuit and test circuitry
- Patent number 12,188,982
- Issue date Jan 7, 2025
- Realtek Semiconductor Corp.
- Kuo-Wei Chi
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating a flip-chip package core substrate with build...
- Patent number 12,154,866
- Issue date Nov 26, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductance traces protected through shielding layers
- Patent number 12,094,922
- Issue date Sep 17, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver of communication system and eye diagram measuring method
- Patent number 12,088,359
- Issue date Sep 10, 2024
- Realtek Semiconductor Corporation
- Shih-Chang Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package having redistribution layer structure with protective layer
- Patent number 12,057,406
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having redistribution layer structure with protective layer...
- Patent number 12,014,993
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data transmission apparatus and method having clock gating mechanism
- Patent number 12,009,056
- Issue date Jun 11, 2024
- Realtek Semiconductor Corporation
- Fu-Chin Tsai
- G11 - INFORMATION STORAGE
Information Patent Grant
DDR SDRAM signal calibration device and method
- Patent number 11,978,497
- Issue date May 7, 2024
- Realtek Semiconductor Corporation
- Kuo-Wei Chi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including binding agent adhering an integrated...
- Patent number 11,929,345
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,916,028
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,854,936
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,830,844
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system and memory access interface device thereof
- Patent number 11,823,770
- Issue date Nov 21, 2023
- Realtek Semiconductor Corporation
- Ger-Chih Chou
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic device, data strobe gate signal generator circuit and da...
- Patent number 11,816,352
- Issue date Nov 14, 2023
- Realtek Semiconductor Corporation
- Chun-Chi Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package substrate and method for manufacturing the same
- Patent number 11,791,281
- Issue date Oct 17, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,756,852
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,749,612
- Issue date Sep 5, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chun-Hsien Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for manufacturing the same
- Patent number 11,749,619
- Issue date Sep 5, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 11,646,331
- Issue date May 9, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chun-Hsien Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,640,954
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jeng-Nan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,574,853
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 11,545,438
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate, fabrication method and packaging...
- Patent number 11,508,673
- Issue date Nov 22, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical unclonable function based true random number generator, me...
- Patent number 11,487,505
- Issue date Nov 1, 2022
- PUFsecurity Corporation
- Chun-Yuan Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip-chip packaging substrate and method for fabricating the same
- Patent number 11,476,204
- Issue date Oct 18, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate having heat dissipating metal sheet...
- Patent number 11,450,597
- Issue date Sep 20, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package carrier board, method for fabricating the sam...
- Patent number 11,404,348
- Issue date Aug 2, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor packages
- Patent number 11,393,805
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY CONTROLLER AND MEMORY DATA RECEIVING METHOD
- Publication number 20240402915
- Publication date Dec 5, 2024
- Realtek Semiconductor Corp.
- Shih-Chang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER...
- Publication number 20240355756
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory system, memory access interface device and operation method...
- Publication number 20240310869
- Publication date Sep 19, 2024
- Realtek Semiconductor Corp.
- FU-CHIN TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Memory system, memory access interface device and operation method...
- Publication number 20240231416
- Publication date Jul 11, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- FU-CHIN TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Memory system and memory access interface device thereof
- Publication number 20240233837
- Publication date Jul 11, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- FU-CHIN TSAI
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240170419
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory system, memory access interface device and operation method...
- Publication number 20240134410
- Publication date Apr 25, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- FU-CHIN TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Memory system and memory access interface device thereof
- Publication number 20240135999
- Publication date Apr 25, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- FU-CHIN TSAI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087986
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240047404
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Data transmission apparatus and method having clock gating mechanism
- Publication number 20240013824
- Publication date Jan 11, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- FU-CHIN TSAI
- G11 - INFORMATION STORAGE
Information Patent Application
RECEIVER OF COMMUNICATION SYSTEM AND EYE DIAGRAM MEASURING METHOD
- Publication number 20240007208
- Publication date Jan 4, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- Shih-Chang CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Memory system and memory access interface device thereof
- Publication number 20230360683
- Publication date Nov 9, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- GER-CHIH CHOU
- G11 - INFORMATION STORAGE
Information Patent Application
Memory controller and method for calibrating data reception window
- Publication number 20230307038
- Publication date Sep 28, 2023
- Realtek Semiconductor Corp.
- Shih-Chang Chen
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230170280
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DDR SDRAM signal calibration device and method
- Publication number 20230154524
- Publication date May 18, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- KUO-WEI CHI
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE, DATA STROBE GATE SIGNAL GENERATOR CIRCUIT AND DA...
- Publication number 20230126654
- Publication date Apr 27, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- Chun-Chi YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEST METHOD FOR DELAY CIRCUIT AND TEST CIRCUITRY
- Publication number 20230011710
- Publication date Jan 12, 2023
- Realtek Semiconductor Corp.
- KUO-WEI CHI
- G01 - MEASURING TESTING
Information Patent Application
FLIP-CHIP PACKAGING SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220406734
- Publication date Dec 22, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20220336362
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTANCE STRUCTURE
- Publication number 20220328613
- Publication date Oct 13, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER
- Publication number 20220302038
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR PACKAGES
- Publication number 20220302100
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220302068
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220262703
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220238408
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING METHOD AND DEVICE USED IN NEURAL NETWORK
- Publication number 20220207346
- Publication date Jun 30, 2022
- Industrial Technology Research Institute
- Chao-Hung CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20220173048
- Publication date Jun 2, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chun-Hsien Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407887
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

3D semiconductor packages

Test method for delay circuit and test circuitry

Method of fabricating a flip-chip package core substrate with build...

Inductance traces protected through shielding layers

Receiver of communication system and eye diagram measuring method

Package having redistribution layer structure with protective layer

Package having redistribution layer structure with protective layer...

Data transmission apparatus and method having clock gating mechanism

DDR SDRAM signal calibration device and method

Semiconductor package and manufacturing method thereof

Semiconductor device including binding agent adhering an integrated...

Package structure and method of forming the same

Semiconductor device

Semiconductor structure

Memory system and memory access interface device thereof

Electronic device, data strobe gate signal generator circuit and da...

Package substrate and method for manufacturing the same

Semiconductor device

Semiconductor package device

Package substrate and method for manufacturing the same

Package substrate

Semiconductor package structure

Semiconductor device

Semiconductor packages and methods of forming the same

Semiconductor packaging substrate, fabrication method and packaging...

Physical unclonable function based true random number generator, me...

Flip-chip packaging substrate and method for fabricating the same

Semiconductor package substrate having heat dissipating metal sheet...

Semiconductor package carrier board, method for fabricating the sam...

3D semiconductor packages

Patents Applicationslast 30 patents

MEMORY CONTROLLER AND MEMORY DATA RECEIVING METHOD

PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER...

Memory system, memory access interface device and operation method...

Memory system, memory access interface device and operation method...

Memory system and memory access interface device thereof

PACKAGE STRUCTURE

Memory system, memory access interface device and operation method...

Memory system and memory access interface device thereof

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

Data transmission apparatus and method having clock gating mechanism

RECEIVER OF COMMUNICATION SYSTEM AND EYE DIAGRAM MEASURING METHOD

Memory system and memory access interface device thereof

Memory controller and method for calibrating data reception window

SEMICONDUCTOR DEVICE

DDR SDRAM signal calibration device and method

ELECTRONIC DEVICE, DATA STROBE GATE SIGNAL GENERATOR CIRCUIT AND DA...

TEST METHOD FOR DELAY CIRCUIT AND TEST CIRCUITRY

FLIP-CHIP PACKAGING SUBSTRATE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

INDUCTANCE STRUCTURE

PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER

3D SEMICONDUCTOR PACKAGES

SEMICONDUCTOR STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

DATA PROCESSING METHOD AND DEVICE USED IN NEURAL NETWORK

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR DEVICE