Chun-Wei CHIA

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming an image sensor having stress releasing structure
- Patent number 12,224,297
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench structure for reduced wafer cracking
- Patent number 12,211,805
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-protrusion transfer gate manufacturing method
- Patent number 12,211,862
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Huei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic radiation detection method
- Patent number 12,176,361
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Huei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daisy-chain seal ring structure
- Patent number 12,170,234
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor comprising polysilicon gate electrode and nitride hard...
- Patent number 11,837,622
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daisy-chain seal ring structure
- Patent number 11,756,842
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having stress releasing structure and method of formin...
- Patent number 11,569,288
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having stress releasing structure and method of formin...
- Patent number 11,569,289
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-protrusion transfer gate structure
- Patent number 11,521,997
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Huei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming image sensor
- Patent number 11,444,116
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having isolation structure
- Patent number 11,164,902
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having stress releasing structure and method of formin...
- Patent number 10,985,199
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 10,879,305
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure and image sensor
- Patent number 10,714,523
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming polysilicon gate structure in image sensor device
- Patent number 10,204,960
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure for reducing crosstalk between pixels and fabri...
- Patent number 10,157,949
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE
- Publication number 20250185403
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSOR WITH MULTI-PROTRUSION TRANSFER GATE
- Publication number 20250176287
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Huei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH STRUCTURE FOR REDUCED WAFER CRACKING
- Publication number 20250118684
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAISY-CHAIN SEAL RING STRUCTURE
- Publication number 20250062166
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR AND METHOD FOR MAKING THE SAME
- Publication number 20240355847
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSOR ARRAYS AND METHODS OF FORMATION
- Publication number 20240274636
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR
- Publication number 20240006425
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAISY-CHAIN SEAL RING STRUCTURE
- Publication number 20230326815
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE
- Publication number 20230163150
- Publication date May 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PROTRUSION TRANSFER GATE MANUFACTURING METHOD
- Publication number 20230078927
- Publication date Mar 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Huei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20220384514
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei CHIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC RADIATION DETECTION METHOD
- Publication number 20220359590
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Huei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAISY-CHAIN SEAL RING STRUCTURE
- Publication number 20220336299
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH STRUCTURE FOR REDUCED WAFER CRACKING
- Publication number 20220310533
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE AND METHOD OF FORMIN...
- Publication number 20210384247
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE, DEVICE, AND METHOD
- Publication number 20210327947
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kun-Huei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE AND METHOD OF FORMIN...
- Publication number 20210225920
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING IMAGE SENSOR
- Publication number 20210118939
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei CHIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING ISOLATION STRUCTURE
- Publication number 20200343282
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE AND METHOD OF FORMIN...
- Publication number 20200135789
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20190172870
- Publication date Jun 6, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei CHIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE AND IMAGE SENSOR
- Publication number 20190139998
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE FOR REDUCING CROSSTALK BETWEEN PIXELS AND FABRI...
- Publication number 20180269237
- Publication date Sep 20, 2018
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING POLYSILICON GATE STRUCTURE IN IMAGE SENSOR DEVICE
- Publication number 20170084664
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei CHIA
- H01 - BASIC ELECTRIC ELEMENTS

Chun-Wei CHIA

Person

Patents Grantslast 30 patents

Method of forming an image sensor having stress releasing structure

Trench structure for reduced wafer cracking

Multi-protrusion transfer gate manufacturing method

Electromagnetic radiation detection method

Daisy-chain seal ring structure

Image sensor comprising polysilicon gate electrode and nitride hard...

Daisy-chain seal ring structure

Image sensor having stress releasing structure and method of formin...

Image sensor having stress releasing structure and method of formin...

Multi-protrusion transfer gate structure

Method for forming image sensor

Image sensor having isolation structure

Image sensor having stress releasing structure and method of formin...

Image sensor

Isolation structure and image sensor

Method of forming polysilicon gate structure in image sensor device

Isolation structure for reducing crosstalk between pixels and fabri...

Patents Applicationslast 30 patents

IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE

PIXEL SENSOR WITH MULTI-PROTRUSION TRANSFER GATE

TRENCH STRUCTURE FOR REDUCED WAFER CRACKING

DAISY-CHAIN SEAL RING STRUCTURE

CMOS IMAGE SENSOR AND METHOD FOR MAKING THE SAME

PIXEL SENSOR ARRAYS AND METHODS OF FORMATION

CMOS IMAGE SENSOR

DAISY-CHAIN SEAL RING STRUCTURE

METHOD OF FORMING AN IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE

MULTI-PROTRUSION TRANSFER GATE MANUFACTURING METHOD

IMAGE SENSOR

ELECTROMAGNETIC RADIATION DETECTION METHOD

DAISY-CHAIN SEAL RING STRUCTURE

TRENCH STRUCTURE FOR REDUCED WAFER CRACKING

IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE AND METHOD OF FORMIN...

INTEGRATED CIRCUIT STRUCTURE, DEVICE, AND METHOD

IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE AND METHOD OF FORMIN...

METHOD FOR FORMING IMAGE SENSOR

IMAGE SENSOR HAVING ISOLATION STRUCTURE

IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE AND METHOD OF FORMIN...

IMAGE SENSOR

ISOLATION STRUCTURE AND IMAGE SENSOR

ISOLATION STRUCTURE FOR REDUCING CROSSTALK BETWEEN PIXELS AND FABRI...

METHOD OF FORMING POLYSILICON GATE STRUCTURE IN IMAGE SENSOR DEVICE