Chun-Wei Yeh

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Taichung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating package structure
- Patent number 9,524,944
- Issue date Dec 20, 2016
- Siliconware Precision Industries Co., Ltd.
- Chun-Wei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,362,245
- Issue date Jun 7, 2016
- Siliconware Precision Industries Co., Ltd.
- Chun-Wei Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURE
- Publication number 20160247773
- Publication date Aug 25, 2016
- Siliconware Precision Industries Co., Ltd.
- Chun-Wei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20140327131
- Publication date Nov 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Chun-Wei Yeh
- H01 - BASIC ELECTRIC ELEMENTS