Chun-Yi Shih

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate structure and semiconductor package structure
- Patent number 11,621,217
- Issue date Apr 4, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device with optimized viewing angle
- Patent number 10,862,011
- Issue date Dec 8, 2020
- Epistar Corporation
- Yih-Hua Renn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and manufacturing method thereof
- Patent number 10,522,721
- Issue date Dec 31, 2019
- Epistar Corporation
- Ching-Tai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,344,383
- Issue date Jul 9, 2019
- Advanced Semiconductor Engineering, Inc.
- Chuan-Yung Shih
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light-emitting device and manufacturing method thereof
- Patent number 10,312,423
- Issue date Jun 4, 2019
- Epistar Corporation
- Ching-Tai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asynchronous pipeline circuit
- Patent number 10,157,249
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiang Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light-emitting device
- Patent number 10,147,852
- Issue date Dec 4, 2018
- Epistar Corporation
- Ching-Tai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and manufacturing method thereof
- Patent number 10,062,816
- Issue date Aug 28, 2018
- Epistar Corporation
- Ching-Tai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 9,966,502
- Issue date May 8, 2018
- Epistar Corporation
- Ching-Tai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 9,871,174
- Issue date Jan 16, 2018
- Epistar Corporation
- Ching-Tai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making buried contact in DRAM technology
- Patent number 5,846,860
- Issue date Dec 8, 1998
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a tungsten silicide capacitor having a high break...
- Patent number 5,804,488
- Issue date Sep 8, 1998
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of eliminating buried contact trench in SRAM technology
- Patent number 5,654,231
- Issue date Aug 5, 1997
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mong-Song Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making high precision w-polycide-to-poly capacitors in di...
- Patent number 5,554,558
- Issue date Sep 10, 1996
- Taiwan Semiconductor Manufacturing Company
- Shun-Liang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a real time ion implantation metal silicide monitor
- Patent number 5,451,529
- Issue date Sep 19, 1995
- Taiwan Semiconductor Manufacturing Company
- Shun-Liang Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220230946
- Publication date Jul 21, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190040527
- Publication date Feb 7, 2019
- Advanced Semiconductor Engineering, Inc.
- Chuan-Yung SHIH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337313
- Publication date Nov 22, 2018
- EPISTAR CORPORATION
- Ching-Tai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20180151783
- Publication date May 31, 2018
- EPISTAR CORPORATION
- Ching-Tai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180053882
- Publication date Feb 22, 2018
- EPISTAR CORPORATION
- Ching-Tai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYNCHRONOUS PIPELINE CIRCUIT
- Publication number 20170344670
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Hsiang LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20170288095
- Publication date Oct 5, 2017
- EPISTAR CORPORATION
- Ching-Tai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170222102
- Publication date Aug 3, 2017
- EPISTAR CORPORATION
- Ching-Tai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20170162763
- Publication date Jun 8, 2017
- EPISTAR CORPORATION
- Ching-Tai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170077364
- Publication date Mar 16, 2017
- EPISTAR CORPORATION
- Yih-Hua RENN
- H01 - BASIC ELECTRIC ELEMENTS

Chun-Yi Shih

Person

Patents Grantslast 30 patents

Substrate structure and semiconductor package structure

Light-emitting device with optimized viewing angle

Light-emitting device and manufacturing method thereof

Semiconductor package device and method of manufacturing the same

Light-emitting device and manufacturing method thereof

Asynchronous pipeline circuit

Light-emitting device

Light-emitting device and manufacturing method thereof

Light-emitting device

Light-emitting device

Method of making buried contact in DRAM technology

Method of forming a tungsten silicide capacitor having a high break...

Method of eliminating buried contact trench in SRAM technology

Method of making high precision w-polycide-to-poly capacitors in di...

Method of making a real time ion implantation metal silicide monitor

Patents Applicationslast 30 patents

SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING DEVICE

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

ASYNCHRONOUS PIPELINE CIRCUIT

LIGHT-EMITTING DEVICE

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING DEVICE

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF