Chun Yu Li

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for molding a semiconductor device
- Patent number 7,241,414
- Issue date Jul 10, 2007
- ASM Technology Singapore Pte. Ltd.
- Shu C Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic device with high lead density
- Publication number 20060105501
- Publication date May 18, 2006
- ASM Technology Singapore Pte Ltd
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for molding a semiconductor device
- Publication number 20050287236
- Publication date Dec 29, 2005
- ASM Technology Singapore Pte Ltd
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device with high lead density
- Publication number 20050248041
- Publication date Nov 10, 2005
- ATM Technology Singapore Pte Ltd
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS