Chun Yu Tseng

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure, manufacturing method thereof and method fo...
- Patent number 11,688,651
- Issue date Jun 27, 2023
- Winbond Electronics Corp.
- Hung-Ming Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive structure for heat dissipation in semiconducto...
- Patent number 11,658,044
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive molding compound structure for heat dissipatio...
- Patent number 11,574,886
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication polymer waveguide
- Patent number 11,125,940
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Grant
Method for forming semiconductor package using carbon nano material...
- Patent number 11,088,058
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion promoter apparatus and method
- Patent number 10,983,278
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Grant
Thermally conductive structure for heat dissipation in semiconducto...
- Patent number 10,957,559
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate mask-pellicle system
- Patent number 10,859,908
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Thermally conductive molding compound structure for heat dissipatio...
- Patent number 10,861,817
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive molding compound structure for heat dissipatio...
- Patent number 10,784,227
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method for integration of heterogeneous integrated circ...
- Patent number 10,748,825
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phosphinated poly(2,6-dimethyl phenylene oxide) oligomers and therm...
- Patent number 10,544,261
- Issue date Jan 28, 2020
- Chang Chun Plastics Co., Ltd.
- Ching Hsuan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Optical bench on substrate
- Patent number 10,539,751
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lee
- G02 - OPTICS
Information Patent Grant
Thermally conductive structure for heat dissipation in semiconducto...
- Patent number 10,541,154
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive molding compound structure for heat dissipatio...
- Patent number 10,510,707
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package using carbon nano material...
- Patent number 10,490,492
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical cylindrical reaction chamber for micro LED epitaxy and lin...
- Patent number 10,490,690
- Issue date Nov 26, 2019
- NEWGO DESIGN STUDIO
- Chun-Lin Tseng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of fabrication polymer waveguide
- Patent number 10,408,998
- Issue date Sep 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Grant
Structure of paper cup with integrated outflow tube
- Patent number 10,377,550
- Issue date Aug 13, 2019
- NEWGO DESIGN STUDIO
- Chun-Lin Tseng
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Package and method for integration of heterogeneous integrated circ...
- Patent number 10,276,471
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical bench on substrate
- Patent number 10,180,547
- Issue date Jan 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lee
- G02 - OPTICS
Information Patent Grant
Method for forming semiconductor package using carbon nano material...
- Patent number 10,177,082
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum carrier module, method of using and process of making the same
- Patent number 10,137,603
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Yu Huang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus and method of forming chip package with waveguide for lig...
- Patent number 10,135,224
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Grant
Adhesion promoter apparatus and method
- Patent number 10,082,626
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive molding compound structure for heat dissipatio...
- Patent number 9,960,099
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication polymer waveguide
- Patent number 9,910,217
- Issue date Mar 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Grant
Vacuum carrier module, method of using and process of making the same
- Patent number 9,902,092
- Issue date Feb 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Yu Huang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Package and method for integration of heterogeneous integrated circ...
- Patent number 9,865,481
- Issue date Jan 9, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package using carbon nano material...
- Patent number 9,859,199
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...
- Publication number 20210202270
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...
- Publication number 20210104485
- Publication date Apr 8, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, MANUFACTURING METHOD THEREOF AND METHOD FO...
- Publication number 20200286796
- Publication date Sep 10, 2020
- WINBOND ELECTRONICS CORP.
- Hung-Ming Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...
- Publication number 20200066671
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...
- Publication number 20200043838
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...
- Publication number 20200020658
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...
- Publication number 20200013636
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabrication Polymer Waveguide
- Publication number 20200003951
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Application
PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRC...
- Publication number 20190237379
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BENCH ON SUBSTRATE
- Publication number 20190146165
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu LEE
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...
- Publication number 20190131222
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion Promoter Apparatus and Method
- Publication number 20190025514
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...
- Publication number 20180247912
- Publication date Aug 30, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabrication Polymer Waveguide
- Publication number 20180188451
- Publication date Jul 5, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Application
Package and Method for Integration of Heterogeneous Integrated Circ...
- Publication number 20180138056
- Publication date May 17, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...
- Publication number 20180090425
- Publication date Mar 29, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FABRICATE MASK-PELLICLE SYSTEM
- Publication number 20180088459
- Publication date Mar 29, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- Chun-Hao TSENG
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Vacuum Carrier Module, Method of Using and Process of Making the Same
- Publication number 20180056548
- Publication date Mar 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Yu Huang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...
- Publication number 20170140945
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOSPHINATED POLY(2,6-DIMETHYL PHENYLENE OXIDE) OLIGOMERS AND THERM...
- Publication number 20170101507
- Publication date Apr 13, 2017
- Chang Chun Plastics Co., Ltd.
- Ching Hsuan Lin
- C07 - ORGANIC CHEMISTRY
Information Patent Application
METHOD TO FABRICATE MASK-PELLICLE SYSTEM
- Publication number 20170082920
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Adhesion Promoter Apparatus and Method
- Publication number 20170075065
- Publication date Mar 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Application
APPARATUS AND METHOD OF FORMING CHIP PACKAGE WITH WAVEGUIDE FOR LIG...
- Publication number 20170077673
- Publication date Mar 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Application
Apparatus and Package Structure of Optical Chip
- Publication number 20170033094
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu LEE
- G02 - OPTICS
Information Patent Application
PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRC...
- Publication number 20160343697
- Publication date Nov 24, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cellular Phone With Built-In Selfie Stick
- Publication number 20160337492
- Publication date Nov 17, 2016
- Chun-Lin Tseng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS AND PACKAGE STRUCTURE OF OPTICAL CHIP
- Publication number 20150287705
- Publication date Oct 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu LEE
- G02 - OPTICS
Information Patent Application
Method of Fabrication Polymer Waveguide
- Publication number 20150253500
- Publication date Sep 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...
- Publication number 20150170990
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM CARRIER MODULE, METHOD OF USING AND PROCESS OF MAKING THE SAME
- Publication number 20150147852
- Publication date May 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Yu HUANG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Chun Yu Tseng

Person

Patents Grantslast 30 patents

Semiconductor structure, manufacturing method thereof and method fo...

Thermally conductive structure for heat dissipation in semiconducto...

Thermally conductive molding compound structure for heat dissipatio...

Method of fabrication polymer waveguide

Method for forming semiconductor package using carbon nano material...

Adhesion promoter apparatus and method

Thermally conductive structure for heat dissipation in semiconducto...

Method to fabricate mask-pellicle system

Thermally conductive molding compound structure for heat dissipatio...

Thermally conductive molding compound structure for heat dissipatio...

Package and method for integration of heterogeneous integrated circ...

Phosphinated poly(2,6-dimethyl phenylene oxide) oligomers and therm...

Optical bench on substrate

Thermally conductive structure for heat dissipation in semiconducto...

Thermally conductive molding compound structure for heat dissipatio...

Method for forming semiconductor package using carbon nano material...

Vertical cylindrical reaction chamber for micro LED epitaxy and lin...

Method of fabrication polymer waveguide

Structure of paper cup with integrated outflow tube

Package and method for integration of heterogeneous integrated circ...

Optical bench on substrate

Method for forming semiconductor package using carbon nano material...

Vacuum carrier module, method of using and process of making the same

Apparatus and method of forming chip package with waveguide for lig...

Adhesion promoter apparatus and method

Thermally conductive molding compound structure for heat dissipatio...

Method of fabrication polymer waveguide

Vacuum carrier module, method of using and process of making the same

Package and method for integration of heterogeneous integrated circ...

Method for forming semiconductor package using carbon nano material...

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...

THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...

SEMICONDUCTOR STRUCTURE, MANUFACTURING METHOD THEREOF AND METHOD FO...

THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...

METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...

THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...

THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...

Method of Fabrication Polymer Waveguide

PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRC...

OPTICAL BENCH ON SUBSTRATE

METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...

Adhesion Promoter Apparatus and Method

THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...

Method of Fabrication Polymer Waveguide

Package and Method for Integration of Heterogeneous Integrated Circ...

METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...

METHOD TO FABRICATE MASK-PELLICLE SYSTEM

Vacuum Carrier Module, Method of Using and Process of Making the Same

THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...

PHOSPHINATED POLY(2,6-DIMETHYL PHENYLENE OXIDE) OLIGOMERS AND THERM...

METHOD TO FABRICATE MASK-PELLICLE SYSTEM

Adhesion Promoter Apparatus and Method

APPARATUS AND METHOD OF FORMING CHIP PACKAGE WITH WAVEGUIDE FOR LIG...

Apparatus and Package Structure of Optical Chip

PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRC...

Cellular Phone With Built-In Selfie Stick

APPARATUS AND PACKAGE STRUCTURE OF OPTICAL CHIP

Method of Fabrication Polymer Waveguide

METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...

VACUUM CARRIER MODULE, METHOD OF USING AND PROCESS OF MAKING THE SAME