Chun-Yuan Hou

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Zhubie, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a chip package module with improve heat dissi...
- Patent number 11,145,565
- Issue date Oct 12, 2021
- Youngtek Electronics Corporation
- Hsi-Ying Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded substrate package structure
- Patent number 10,115,673
- Issue date Oct 30, 2018
- Sung-Lien He
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE MODULE WITH HEAT DISSIPATION FUNCTION AND MANUFACTURIN...
- Publication number 20210043532
- Publication date Feb 11, 2021
- YOUNGTEK ELECTRONICS CORPORATION
- HSI-YING YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SUBSTRATE PACKAGE STRUCTURE
- Publication number 20180315712
- Publication date Nov 1, 2018
- Holien Technology Co., LTD.
- Sung-Lien He
- H01 - BASIC ELECTRIC ELEMENTS