Chundong LI

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
Via-hole etching method
- Patent number 9,564,354
- Issue date Feb 7, 2017
- BOE Technology Group Co., Ltd.
- Byung Chun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIA-HOLE ETCHING METHOD
- Publication number 20150303099
- Publication date Oct 22, 2015
- BOE TECHNOLOGY GROUP CO., LTD.
- Byung Chun LEE
- H01 - BASIC ELECTRIC ELEMENTS