Chung C. Key

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for solder crack deflection
- Patent number 7,923,125
- Issue date Apr 12, 2011
- Intel Corporation
- Chung C. Key
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper ring solder mask defined ball grid array pad
- Patent number 7,230,339
- Issue date Jun 12, 2007
- Intel Corporation
- Chung C. Key
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for solder crack deflection
- Patent number 7,223,633
- Issue date May 29, 2007
- Intel Corporation
- Chung C. Key
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus for solder crack deflection
- Publication number 20070170592
- Publication date Jul 26, 2007
- Chung C. Key
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Copper ring solder mask defined ball grid array pad
- Publication number 20040188836
- Publication date Sep 30, 2004
- Intel Corporation
- Chung C. Key
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for solder crack deflection
- Publication number 20040102029
- Publication date May 27, 2004
- Chung C. Key
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...