Chung-Chieh TING

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor device having dummy micro bumps...
- Patent number 12,020,952
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation process
- Patent number 11,443,976
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with dummy micro bumps between stacking dies t...
- Patent number 11,101,145
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING DUMMY MICRO BUMPS...
- Publication number 20240304466
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION PROCESS
- Publication number 20220392799
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Lei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION PROCESS
- Publication number 20220122880
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Lei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING DUMMY MICRO BUMPS...
- Publication number 20210384044
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DUMMY MICRO BUMPS BETWEEN STACKING DIES T...
- Publication number 20200058519
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS