Chung-Chuan Tseng

Person

  • Hsin-Chu, TW

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Image Sensors With Dummy Pixel Structures

    • Publication number 20240371910
    • Publication date Nov 7, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Wei Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BSI CHIP WITH BACKSIDE ALIGNMENT MARK

    • Publication number 20240363791
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih Wei Sung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

    • Publication number 20240321933
    • Publication date Sep 26, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yeh-Hsun Fang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NOVEL IMAGE SENSOR DEVICE

    • Publication number 20240055449
    • Publication date Feb 15, 2024
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Chen-Hsiang Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE INCLUDING MIM CAPACITOR AND RESISTOR

    • Publication number 20230395595
    • Publication date Dec 7, 2023
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Chen-Hsiang HUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS FOR FORMING IMAGE SENSORS

    • Publication number 20230378218
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chiao-Chi Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

    • Publication number 20230378234
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yeh-Hsun Fang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20230317743
    • Publication date Oct 5, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Zong-Jie WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT INCLUDING TRENCH CAPACITOR

    • Publication number 20230261039
    • Publication date Aug 17, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Wen-Feng KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Image Sensors With Dummy Pixel Structures

    • Publication number 20230246056
    • Publication date Aug 3, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yu-Wei CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL FINGERPRINT IMAGING DEVICE

    • Publication number 20230162527
    • Publication date May 25, 2023
    • GINGY TECHNOLOGY INC.
    • Ping-Chen Chen
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

    • Publication number 20230093001
    • Publication date Mar 23, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yeh-Hsun Fang
    • G01 - MEASURING TESTING
  • Information Patent Application

    NOVEL IMAGE SENSOR DEVICE

    • Publication number 20230034661
    • Publication date Feb 2, 2023
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Chen-Hsiang Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INFRARED IMAGE SENSOR COMPONENT MANUFACTURING METHOD

    • Publication number 20220384503
    • Publication date Dec 1, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chien-Ying WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS FOR FORMING IMAGE SENSORS

    • Publication number 20220375972
    • Publication date Nov 24, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chiao-Chi Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BSI Chip with Backside Alignment Mark

    • Publication number 20220359781
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih Wei Sung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE CAPTURE DEVICE

    • Publication number 20220359624
    • Publication date Nov 10, 2022
    • GINGY TECHNOLOGY INC.
    • Chung Hao Tseng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT INCLUDING TRENCH CAPACITOR

    • Publication number 20220271119
    • Publication date Aug 25, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Wen-Feng KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANALOG-TO-DIGITAL CONVERSION SYSTEM AND METHOD

    • Publication number 20220231696
    • Publication date Jul 21, 2022
    • REALTEK SEMICONDUCTOR CORPORATION
    • SHUN-TA WU
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    ANALOG FRONT-END CIRCUIT CAPABLE OF DYNAMICALLY ADJUSTING GAIN

    • Publication number 20220231646
    • Publication date Jul 21, 2022
    • Realtek Semiconductor Corp.
    • CHIEN-MING WU
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME

    • Publication number 20220052105
    • Publication date Feb 17, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chiao-Chi WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS FOR FORMING IMAGE SENSORS

    • Publication number 20220045109
    • Publication date Feb 10, 2022
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Chiao-Chi Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

    • Publication number 20210391378
    • Publication date Dec 16, 2021
    • Taiwan Semiconductor Manufacturing Company Limited
    • Yeh-Hsun Fang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSORS WITH DUMMY PIXEL STRUCTURES

    • Publication number 20210272988
    • Publication date Sep 2, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yu-Wei CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Communication apparatus and digital to analog conversion circuit th...

    • Publication number 20210218602
    • Publication date Jul 15, 2021
    • REALTEK SEMICONDUCTOR CORPORATION
    • CHIEN-MING WU
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20210098514
    • Publication date Apr 1, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Zong-Jie WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MAKING A TRENCH CAPACITOR AND TRENCH CAPACITOR

    • Publication number 20210074806
    • Publication date Mar 11, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Hsiang TSAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NOVEL IMAGE SENSOR DEVICE

    • Publication number 20210066366
    • Publication date Mar 4, 2021
    • Taiwan Serniconductor Manufacturing Co., Ltd.
    • Chen-Hsiang HUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MAKING AN IMAGE SENSOR WITH SIDEWALL PROTECTION

    • Publication number 20210043675
    • Publication date Feb 11, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chiao-Chi WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BSI Chip with Backside Alignment Mark

    • Publication number 20210036179
    • Publication date Feb 4, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih Wei Sung
    • H01 - BASIC ELECTRIC ELEMENTS