Chung-Hsiao Lai

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KAOHSIUNG, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,855,034
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,798,907
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and semiconductor package structure
- Patent number 11,621,217
- Issue date Apr 4, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413115
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Ling YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384381
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220230946
- Publication date Jul 21, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220148989
- Publication date May 12, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION AND FLEXIBLE LAMINATE
- Publication number 20180186133
- Publication date Jul 5, 2018
- TAIFLEX SCIENTIFIC CO., LTD.
- Hsiu-Chu Wu
- B32 - LAYERED PRODUCTS