Chung-Hsien Liu

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,119,261
- Issue date Oct 15, 2024
- Winbond Electronics Corp.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,105,323
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor device
- Patent number 12,094,728
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure, semiconductor package and fabrication method th...
- Patent number 12,074,122
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,074,143
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,057,359
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package and method
- Patent number 12,051,650
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising rigid-flexible substrate...
- Patent number 12,040,281
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding through multi-shot laser reflow
- Patent number 12,040,309
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and methods forming the same
- Patent number 12,033,883
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for cleaning substrates
- Patent number 12,032,302
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hsuan Liu
- B08 - CLEANING
Information Patent Grant
Method for manufacturing package structure
- Patent number 12,021,037
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure including a silicon substrate interposer and...
- Patent number 12,014,976
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus and manufacturing method of molded semiconductor...
- Patent number 12,011,859
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,009,575
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nan-Chin Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through-via in molding compound and dielectr...
- Patent number 12,009,322
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package structure and methods of forming same
- Patent number 12,009,345
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,002,767
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,002,768
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking structure and method forming same
- Patent number 12,002,799
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control of packages using embedded core frame
- Patent number 11,984,374
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,984,375
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,961,814
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240385370
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...
- Publication number 20240387343
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387392
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240387245
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE FILL FOR STACKED STRUCTURE
- Publication number 20240371818
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240369759
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...
- Publication number 20240363559
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME
- Publication number 20240363586
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240363591
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355691
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240349499
- Publication date Oct 17, 2024
- WINBOND ELECTRONICS CORP.
- Tzu-Yun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240339408
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321780
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME
- Publication number 20240321621
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...
- Publication number 20240321757
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR CLEANING SUBSTRATES
- Publication number 20240310744
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hsuan LIU
- B08 - CLEANING
Information Patent Application
MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF MOLDED SEMI...
- Publication number 20240293962
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240290734
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20240290703
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240282720
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stacking Structure and Method Forming Same
- Publication number 20240274590
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240258187
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL OF PACKAGES USING EMBEDDED CORE FRAME
- Publication number 20240258185
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR COLLECTING AND PRESENTING PHYSIOLOGICAL SIGNAL DATA AND...
- Publication number 20240237953
- Publication date Jul 18, 2024
- SyncVision Technology Corporation
- Kuan Hsien CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING THROUGH MULTI-SHOT LASER REFLOW
- Publication number 20240234365
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240234302
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...
- Publication number 20240222215
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS

Chung-Hsien Liu

Person

Patents Grantslast 30 patents

Semiconductor packages and methods of forming same

Tools and systems for processing semiconductor devices, and methods...

Warpage control in the packaging of integrated circuits

Semiconductor bonding structures and methods

Semiconductor structure and manufacturing method of the same

Method of manufacturing semiconductor structure

Method of forming semiconductor packages having through package vias

Semiconductor package

Semiconductor device

Inductor structure, semiconductor package and fabrication method th...

Integrated circuit package and method

Semiconductor die contact structure and method

Semiconductor package and method of fabricating the same

Semiconductor package and method

Semiconductor package structure comprising rigid-flexible substrate...

Bonding through multi-shot laser reflow

Fan-out interconnect structure and methods forming the same

Method and device for cleaning substrates

Method for manufacturing package structure

Chip package structure including a silicon substrate interposer and...

Molding apparatus and manufacturing method of molded semiconductor...

Package structure

Package structure with through-via in molding compound and dielectr...

3D package structure and methods of forming same

Integrated circuit package and method

Semiconductor package and manufacturing method thereof

Die stacking structure and method forming same

Warpage control of packages using embedded core frame

Integrated circuit package and method

Integrated circuit package and method

Patents Applicationslast 30 patents

PACKAGE AND METHOD OF FORMING SAME

Fingerprint Sensor Device and Method

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...

SEMICONDUCTOR DEVICE AND METHOD

Semiconductor Package and Method

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

EDGE FILL FOR STACKED STRUCTURE

SEMICONDUCTOR PACKAGE

INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...

SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Package and Method

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...

METHOD AND DEVICE FOR CLEANING SUBSTRATES

MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF MOLDED SEMI...

PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

INTEGRATED CIRCUIT PACKAGES

Die Stacking Structure and Method Forming Same

INTEGRATED CIRCUIT PACKAGE AND METHOD

WARPAGE CONTROL OF PACKAGES USING EMBEDDED CORE FRAME

METHODS FOR COLLECTING AND PRESENTING PHYSIOLOGICAL SIGNAL DATA AND...

BONDING THROUGH MULTI-SHOT LASER REFLOW

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...