Chung-Hsien Liu

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,266,673
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor in InFO structure and formation method
- Patent number 12,260,669
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical sensor and glasses
- Patent number 12,259,558
- Issue date Mar 25, 2025
- Asphetek Solution (Chengdu) Ltd.
- Yuan-Ting Liang
- G02 - OPTICS
Information Patent Grant
Bonding passive devices on active dies to form 3D packages
- Patent number 12,255,174
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,218,020
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,210,200
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Sensor device for high speed rotating machine
- Patent number 12,203,781
- Issue date Jan 21, 2025
- Industrial Technology Research Institute
- Xin-Qi Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 12,193,168
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,183,682
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical lens and head-mounted display
- Patent number 12,174,387
- Issue date Dec 24, 2024
- Asphetek Solution (Chengdu) Ltd.
- Chen-An Chiang
- G02 - OPTICS
Information Patent Grant
Semiconductor structure with an air gap and method of forming the same
- Patent number 12,176,440
- Issue date Dec 24, 2024
- Winbond Electronics Corp.
- Shang-Rong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,170,267
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,165,985
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having prism structure and manufacturing method thereof
- Patent number 12,164,158
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Grant
Method of manufacturing a semiconductor package having conductive p...
- Patent number 12,159,822
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having hollow cylinders and method of fabricating...
- Patent number 12,159,851
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,119,261
- Issue date Oct 15, 2024
- Winbond Electronics Corp.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,105,323
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
LENS ASSEMBLY AND AUGMENTED REALITY GLASSES
- Publication number 20250110331
- Publication date Apr 3, 2025
- Asphetek Solution (Chengdu) Ltd.
- SHIUE-LUNG CHEN
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...
- Publication number 20250096198
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS
- Publication number 20250087615
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20250087641
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079326
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH PLANAR SIDEWALL SURFACE FOR OPTICAL COUPLING AND ME...
- Publication number 20250076599
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Fu Tsai
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING PRISM STRUCTURE
- Publication number 20250060542
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Application
LENS ASSEMBLY AND PROCESSING METHOD OF LENS ASSEMBLY
- Publication number 20250060555
- Publication date Feb 20, 2025
- Asphetek Solution (Chengdu) Ltd.
- CHUNG-CHIAO HO
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250053064
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Chun Yang
- G02 - OPTICS
Information Patent Application
INTRAOCULAR PRESSURE DETECTION DEVICE AND GLASSES WITH INTRAOCULAR...
- Publication number 20250049318
- Publication date Feb 13, 2025
- Asphetek Solution (Chengdu) Ltd.
- CHUNG-CHIAO HO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
OPTICAL LENS AND VARIFOCALS
- Publication number 20250028092
- Publication date Jan 23, 2025
- Asphetek Solution (Chengdu) Ltd.
- YUAN-TING LIANG
- G02 - OPTICS
Information Patent Application
METHOD OF PREPARING EYE-TRACKING GLASSES
- Publication number 20250018665
- Publication date Jan 16, 2025
- Asphetek Solution (Chengdu) Ltd.
- YING-HUNG TSAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
REPARATION METHOD OF EYE-TRACKING GLASSES
- Publication number 20250018669
- Publication date Jan 16, 2025
- Asphetek Solution (Chengdu) Ltd.
- YING-HUNG TSAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
- Publication number 20240405005
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395566
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES
- Publication number 20240395769
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240385370
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...
- Publication number 20240387343
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387392
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240387245
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE FILL FOR STACKED STRUCTURE
- Publication number 20240371818
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240369759
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...
- Publication number 20240363559
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME
- Publication number 20240363586
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240363591
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Chung-Hsien Liu

Person

Patents Grantslast 30 patents

Integrated devices in semiconductor packages and methods of forming...

Semiconductor package and method of forming the same

Fingerprint sensor in InFO structure and formation method

Optical sensor and glasses

Bonding passive devices on active dies to form 3D packages

Package structure with warpage-control element

Package and method of forming same

Semiconductor packages

Photonic semiconductor device and method of manufacture

Sensor device for high speed rotating machine

Sensor packages

Semiconductor device, circuit board structure and manufacturing met...

Circuit board and semiconductor device including the same

Semiconductor package and manufacturing method thereof

Manufacturing method of semiconductor package

Optical lens and head-mounted display

Semiconductor structure with an air gap and method of forming the same

Semiconductor device and method of manufacture

Semiconductor device and method

Package having prism structure and manufacturing method thereof

Method of manufacturing a semiconductor package having conductive p...

Package structure having hollow cylinders and method of fabricating...

Warpage control in the packaging of integrated circuits

Semiconductor packages and methods of forming same

Tools and systems for processing semiconductor devices, and methods...

Semiconductor bonding structures and methods

Semiconductor structure and manufacturing method of the same

Method of manufacturing semiconductor structure

Method of forming semiconductor packages having through package vias

Semiconductor package

Patents Applicationslast 30 patents

LENS ASSEMBLY AND AUGMENTED REALITY GLASSES

SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...

METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTERPOSER WITH PLANAR SIDEWALL SURFACE FOR OPTICAL COUPLING AND ME...

SEMICONDUCTOR PACKAGE

PACKAGE HAVING PRISM STRUCTURE

LENS ASSEMBLY AND PROCESSING METHOD OF LENS ASSEMBLY

OPTICAL DEVICES AND METHODS OF MANUFACTURE

INTRAOCULAR PRESSURE DETECTION DEVICE AND GLASSES WITH INTRAOCULAR...

OPTICAL LENS AND VARIFOCALS

METHOD OF PREPARING EYE-TRACKING GLASSES

REPARATION METHOD OF EYE-TRACKING GLASSES

IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING

SEMICONDUCTOR DEVICE

BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

PACKAGE AND METHOD OF FORMING SAME

Fingerprint Sensor Device and Method

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...

SEMICONDUCTOR DEVICE AND METHOD

Semiconductor Package and Method

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

EDGE FILL FOR STACKED STRUCTURE

SEMICONDUCTOR PACKAGE

INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...

SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD