-
-
SUBSTRATE AND PACKAGE STRUCTURE
-
Publication number 20240136317
-
Publication date Apr 25, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Wei-Hung Lin
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
Semiconductor Package and Method
-
Publication number 20240021467
-
Publication date Jan 18, 2024
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Chen-Hua Yu
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
SEMICONDUCTOR PACKAGE
-
Publication number 20230367062
-
Publication date Nov 16, 2023
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Chung-Ming Weng
-
G02 - OPTICS
-
-
-
-
-
SENSOR PACKAGES
-
Publication number 20230352357
-
Publication date Nov 2, 2023
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Tsung-Hsien Chiang
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
Fingerprint Sensor Device and Method
-
Publication number 20230343133
-
Publication date Oct 26, 2023
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Yu-Chih Huang
-
G06 - COMPUTING CALCULATING COUNTING
-
-
PACKAGE STRUCTURE WITH ANTENNA ELEMENT
-
Publication number 20230317645
-
Publication date Oct 5, 2023
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Yung-Ping CHIANG
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
Semiconductor Device
-
Publication number 20230307251
-
Publication date Sep 28, 2023
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Zi-Jheng Liu
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
PACKAGE AND METHOD OF FORMING SAME
-
Publication number 20230266528
-
Publication date Aug 24, 2023
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Chih-Hsuan Tai
-
H01 - BASIC ELECTRIC ELEMENTS
-
INTEGRATED CIRCUIT PACKAGE AND METHOD
-
Publication number 20230260862
-
Publication date Aug 17, 2023
-
Taiwan Semiconductor Manufacturing Co., Ltd.
-
Chien-Hsun Chen
-
H01 - BASIC ELECTRIC ELEMENTS
-
PACKAGE STRUCTURE
-
Publication number 20230261361
-
Publication date Aug 17, 2023
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Nan-Chin Chuang
-
H01 - BASIC ELECTRIC ELEMENTS
-
ELECTRONIC ASSEMBLY HAVING CIRCUIT CARRIER
-
Publication number 20230254984
-
Publication date Aug 10, 2023
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Jiun-Yi Wu
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-