Chung-Hwa Feng

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Taoyuan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of packaging flip chip and method of forming pre-solders on...
- Patent number 7,726,544
- Issue date Jun 1, 2010
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of packaging flip chip and method of forming pre-solders on...
- Publication number 20060124703
- Publication date Jun 15, 2006
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR