Chung Kwang Christopher TAN

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package supports
- Patent number 12,176,223
- Issue date Dec 24, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
- Patent number 11,929,330
- Issue date Mar 12, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package supports
- Patent number 11,854,834
- Issue date Dec 26, 2023
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures having tapered profiles for embedded interconnect br...
- Patent number 11,721,631
- Issue date Aug 8, 2023
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 11,676,891
- Issue date Jun 13, 2023
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures having tapered profiles for embedded interconnect br...
- Patent number 11,373,951
- Issue date Jun 28, 2022
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
- Patent number 11,322,444
- Issue date May 3, 2022
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package supports
- Patent number 11,309,192
- Issue date Apr 19, 2022
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene zero-misalignment-via process for semiconductor pack...
- Patent number 11,264,307
- Issue date Mar 1, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 11,088,062
- Issue date Aug 10, 2021
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene zero-misalignment-via process for semiconductor pack...
- Patent number 10,403,564
- Issue date Sep 3, 2019
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20250069902
- Publication date Feb 27, 2025
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20240243066
- Publication date Jul 18, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20240178145
- Publication date May 30, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20240071777
- Publication date Feb 29, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES HAVING TAPERED PROFILES FOR EMBEDDED INTERCONNECT BR...
- Publication number 20220285278
- Publication date Sep 8, 2022
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20220223527
- Publication date Jul 14, 2022
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20220181166
- Publication date Jun 9, 2022
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20210327800
- Publication date Oct 21, 2021
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20190371621
- Publication date Dec 5, 2019
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE ZERO-MISALIGNMENT-VIA PROCESS FOR SEMICONDUCTOR PACK...
- Publication number 20190355647
- Publication date Nov 21, 2019
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES HAVING TAPERED PROFILES FOR EMBEDDED INTERCONNECT BR...
- Publication number 20190304912
- Publication date Oct 3, 2019
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20190295951
- Publication date Sep 26, 2019
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE ZERO-MISALIGNMENT-VIA PROCESS FOR SEMICONDUCTOR PACK...
- Publication number 20190206767
- Publication date Jul 4, 2019
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20190027431
- Publication date Jan 24, 2019
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS

Chung Kwang Christopher TAN

Person

Patents Grantslast 30 patents

Method to enable 30 microns pitch EMIB or below

Integrated circuit package supports

Lithographic cavity formation to enable EMIB bump pitch scaling

Integrated circuit package supports

Via structures having tapered profiles for embedded interconnect br...

Method to enable 30 microns pitch EMIB or below

Via structures having tapered profiles for embedded interconnect br...

Lithographic cavity formation to enable EMIB bump pitch scaling

Integrated circuit package supports

Dual-damascene zero-misalignment-via process for semiconductor pack...

Method to enable 30 microns pitch EMIB or below

Dual-damascene zero-misalignment-via process for semiconductor pack...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE SUPPORTS

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

INTEGRATED CIRCUIT PACKAGE SUPPORTS

VIA STRUCTURES HAVING TAPERED PROFILES FOR EMBEDDED INTERCONNECT BR...

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

INTEGRATED CIRCUIT PACKAGE SUPPORTS

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

INTEGRATED CIRCUIT PACKAGE SUPPORTS

DUAL-DAMASCENE ZERO-MISALIGNMENT-VIA PROCESS FOR SEMICONDUCTOR PACK...

VIA STRUCTURES HAVING TAPERED PROFILES FOR EMBEDDED INTERCONNECT BR...

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

DUAL-DAMASCENE ZERO-MISALIGNMENT-VIA PROCESS FOR SEMICONDUCTOR PACK...

METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW