Chung-Lin Wu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 11,735,508
- Issue date Aug 22, 2023
- SEMICONDUCTOR COMONENTS INDUTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 11,177,203
- Issue date Nov 16, 2021
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies
- Patent number 11,004,777
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging with galvanic isolation
- Patent number 10,943,855
- Issue date Mar 9, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interposer on a leadframe
- Patent number 10,546,847
- Issue date Jan 28, 2020
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation between semiconductor components
- Patent number 10,446,498
- Issue date Oct 15, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- John Constantino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 10,256,178
- Issue date Apr 9, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation between semiconductor components
- Patent number 9,735,112
- Issue date Aug 15, 2017
- Fairchild Semiconductor Corporation
- John Constantino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of manufacturing
- Patent number 9,536,800
- Issue date Jan 3, 2017
- Fairchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including a semiconductor die and a capacitive component
- Patent number 9,478,519
- Issue date Oct 25, 2016
- Fairchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common drain power clip for battery pack protection mosfet
- Patent number 9,379,045
- Issue date Jun 28, 2016
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus related to an improved package including a semiconductor die
- Patent number 9,177,925
- Issue date Nov 3, 2015
- Fairfchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level MOSFET metallization
- Patent number 8,866,218
- Issue date Oct 21, 2014
- Fairchild Semiconductor Corporation
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module power clip
- Patent number 8,723,300
- Issue date May 13, 2014
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,664,752
- Issue date Mar 4, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 8,598,035
- Issue date Dec 3, 2013
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical MOSFET transistor having source/drain contacts disposed on...
- Patent number 8,487,371
- Issue date Jul 16, 2013
- Fairchild Semiconductor Corporation
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced upper and dual heat sink exposed molded leadless p...
- Patent number 8,278,742
- Issue date Oct 2, 2012
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 8,193,043
- Issue date Jun 5, 2012
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,183,088
- Issue date May 22, 2012
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor die structures for wafer-level chipscale packaging of...
- Patent number 8,058,732
- Issue date Nov 15, 2011
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced upper and dual heat sink exposed molded leadless p...
- Patent number 7,968,982
- Issue date Jun 28, 2011
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 7,960,800
- Issue date Jun 14, 2011
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin, thermally enhanced flip chip in a leaded molded package
- Patent number 7,821,124
- Issue date Oct 26, 2010
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 7,800,219
- Issue date Sep 21, 2010
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 7,772,681
- Issue date Aug 10, 2010
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a semiconductor substrate to a metal substrate
- Patent number 7,635,635
- Issue date Dec 22, 2009
- Fairchild Semiconductor Corporation
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure with aperture or groove for flip chip in a lea...
- Patent number 7,525,179
- Issue date Apr 28, 2009
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced upper and dual heat sink exposed molded leadless p...
- Patent number 7,468,548
- Issue date Dec 23, 2008
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20220059443
- Publication date Feb 24, 2022
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20210193561
- Publication date Jun 24, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20200411421
- Publication date Dec 31, 2020
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20190181083
- Publication date Jun 13, 2019
- Fairchild Semiconductor Corporation
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20190067171
- Publication date Feb 28, 2019
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20180068935
- Publication date Mar 8, 2018
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION BETWEEN SEMICONDUCTOR COMPONENTS
- Publication number 20170373008
- Publication date Dec 28, 2017
- FAIRCHILD SEMICONDUCTOR CORPORATION
- John CONSTANTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT
- Publication number 20160126219
- Publication date May 5, 2016
- Fairchild Semiconductor Corporation
- Ahmad R. ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION BETWEEN SEMICONDUCTOR COMPONENTS
- Publication number 20150200162
- Publication date Jul 16, 2015
- Fairchild Semiconductor Corporation
- John CONSTANTINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20150162270
- Publication date Jun 11, 2015
- Fairchild Semiconductor Corporation
- Ahmad R. ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS RELATED TO AN IMPROVED PACKAGE INCLUDING A SE...
- Publication number 20140312458
- Publication date Oct 23, 2014
- Fairchild Semiconductor Corporation
- Ahmad ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON DRAIN POWER CLIP FOR BATTERY PACK PROTECTION MOSFET
- Publication number 20140070392
- Publication date Mar 13, 2014
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE POWER CLIP
- Publication number 20140042599
- Publication date Feb 13, 2014
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL MOSFET METALLIZATION
- Publication number 20130277735
- Publication date Oct 24, 2013
- Daniel M. KINZER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level MOSFET Metallization
- Publication number 20120248526
- Publication date Oct 4, 2012
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120181675
- Publication date Jul 19, 2012
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE WITH BACKSIDE TRENCHES FILLED WITH ELASTIC MATER...
- Publication number 20110230046
- Publication date Sep 22, 2011
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ENHANCED UPPER AND DUAL HEAT SINK EXPOSED MOLDED LEADLESS P...
- Publication number 20110124158
- Publication date May 26, 2011
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAP...
- Publication number 20110059580
- Publication date Mar 10, 2011
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20100258925
- Publication date Oct 14, 2010
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Dice with Backside Trenches Filled With Elastic Mater...
- Publication number 20100148325
- Publication date Jun 17, 2010
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Structures for Wafer-Level Chipscale Packaging of...
- Publication number 20100123225
- Publication date May 20, 2010
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE
- Publication number 20100117231
- Publication date May 13, 2010
- Dennis Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS
- Publication number 20090261461
- Publication date Oct 22, 2009
- Steven Sapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Power Semiconductor Die Packages With Integrated Heat-Sink Cap...
- Publication number 20090166850
- Publication date Jul 2, 2009
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ENHANCED UPPER AND DUAL HEAT SINK EXPOSED MOLDED LEADLESS P...
- Publication number 20090072362
- Publication date Mar 19, 2009
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Synchronizing the Transmission and the Reception of a M...
- Publication number 20080298399
- Publication date Dec 4, 2008
- AUGUSTA TECHNOLOGY, INC.
- Dayin Gou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THIN, THERMALLY ENHANCED FLIP CHIP IN A LEADED MOLDED PACKAGE
- Publication number 20080105957
- Publication date May 8, 2008
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A...
- Publication number 20080054461
- Publication date Mar 6, 2008
- Dennis Lang
- H01 - BASIC ELECTRIC ELEMENTS

Chung-Lin Wu

Person

Patents Grantslast 30 patents

Vertical and horizontal circuit assemblies

Vertical and horizontal circuit assemblies

Semiconductor device assemblies

Electronic device packaging with galvanic isolation

Substrate interposer on a leadframe

Isolation between semiconductor components

Vertical and horizontal circuit assemblies

Isolation between semiconductor components

Packaged semiconductor devices and methods of manufacturing

Package including a semiconductor die and a capacitive component

Common drain power clip for battery pack protection mosfet

Apparatus related to an improved package including a semiconductor die

Semiconductor die package and method for making the same

Wafer level MOSFET metallization

Multi-chip module power clip

Semiconductor die package and method for making the same

Semiconductor dice with backside trenches filled with elastic mater...

Vertical MOSFET transistor having source/drain contacts disposed on...

Thermal enhanced upper and dual heat sink exposed molded leadless p...

High-power semiconductor die packages with integrated heat-sink cap...

Semiconductor die package and method for making the same

Semiconductor die structures for wafer-level chipscale packaging of...

Thermal enhanced upper and dual heat sink exposed molded leadless p...

Semiconductor dice with backside trenches filled with elastic mater...

Thin, thermally enhanced flip chip in a leaded molded package

High-power semiconductor die packages with integrated heat-sink cap...

Semiconductor die package and method for making the same

Method for bonding a semiconductor substrate to a metal substrate

Lead frame structure with aperture or groove for flip chip in a lea...

Thermal enhanced upper and dual heat sink exposed molded leadless p...

Patents Applicationslast 30 patents

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

SEMICONDUCTOR DEVICE ASSEMBLIES

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

ISOLATION BETWEEN SEMICONDUCTOR COMPONENTS

PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT

ISOLATION BETWEEN SEMICONDUCTOR COMPONENTS

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

METHODS AND APPARATUS RELATED TO AN IMPROVED PACKAGE INCLUDING A SE...

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

COMMON DRAIN POWER CLIP FOR BATTERY PACK PROTECTION MOSFET

MULTI-CHIP MODULE POWER CLIP

WAFER LEVEL MOSFET METALLIZATION

Wafer Level MOSFET Metallization

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DICE WITH BACKSIDE TRENCHES FILLED WITH ELASTIC MATER...

THERMAL ENHANCED UPPER AND DUAL HEAT SINK EXPOSED MOLDED LEADLESS P...

HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAP...

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor Dice with Backside Trenches Filled With Elastic Mater...

Semiconductor Die Structures for Wafer-Level Chipscale Packaging of...

RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE

SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS

High-Power Semiconductor Die Packages With Integrated Heat-Sink Cap...

THERMAL ENHANCED UPPER AND DUAL HEAT SINK EXPOSED MOLDED LEADLESS P...

Methods for Synchronizing the Transmission and the Reception of a M...

THIN, THERMALLY ENHANCED FLIP CHIP IN A LEADED MOLDED PACKAGE

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A...