Chung-Lung Lee

Person

Sinjhuang City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method and structure of cut end with self-aligned double patterning
- Patent number 12,368,046
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled dielectric on metal rie lines to increase reliability
- Patent number 12,362,231
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packing lining
- Patent number D1083589
- Issue date Jul 15, 2025
- Acer Incorporated
- Jhih-Hsien Wu
- D09 - Packages and containers for goods
Information Patent Grant
Packing lining
- Patent number D1083600
- Issue date Jul 15, 2025
- Acer Incorporated
- Jhih-Hsien Wu
- D09 - Packages and containers for goods
Information Patent Grant
Methods of etching metals in semiconductor devices
- Patent number 12,354,881
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned interconnect structure
- Patent number 12,322,723
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure using dehydrating chem...
- Patent number 12,317,576
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric on wire structure to increase processing window for over...
- Patent number 12,315,817
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for an MRAM device with a multi-layer top elec...
- Patent number 12,310,255
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Hao Liao
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and structure for semiconductor device having gate spacer pr...
- Patent number 12,308,238
- Issue date May 20, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure etching solution and method for fabricating...
- Patent number 12,308,239
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned conductive features
- Patent number 12,300,600
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic tunnel junction devices
- Patent number 12,302,761
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsi-Wen Tien
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnect conductive structure comprising two conductive materials
- Patent number 12,300,611
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using NC-MRA to generate pelvic veins images and measure...
- Patent number 12,287,387
- Issue date Apr 29, 2025
- CHANG GUNG MEMORIAL HOSPITAL, CHIAYI
- Chien-Wei Chen
- G01 - MEASURING TESTING
Information Patent Grant
Packaging box for bicycle
- Patent number D1071738
- Issue date Apr 22, 2025
- Acer Incorporated
- Jhih-Hsien Wu
- D09 - Packages and containers for goods
Information Patent Grant
Integrated chip with an etch-stop layer forming a cavity
- Patent number 12,266,565
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a low-k dielectric with pillar-type air-gaps
- Patent number 12,261,121
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning approach by direct metal etch
- Patent number 12,243,775
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,165,920
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with inter-wire cavities
- Patent number 12,125,795
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 12,094,823
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 12,074,059
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a barrier layer along the sidewall of...
- Patent number 12,046,551
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustment device switchable between a rotatable state or a locked...
- Patent number 12,000,459
- Issue date Jun 4, 2024
- Pegatron Corporation
- Chung-Wei Lee
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Semiconductor device structure having air gap and method for formin...
- Patent number 11,972,975
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of a protective layer to reduce interconnect s...
- Patent number 11,942,364
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH
- Publication number 20250191973
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH CAVITY STRUCTURE
- Publication number 20250191971
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Traffic Patterned-Based Modem Function Adjustment Method and System...
- Publication number 20250184276
- Publication date Jun 5, 2025
- MEDIATEK INC.
- Wei-Ming Yin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250176210
- Publication date May 29, 2025
- Vanguard International Semiconductor Corporation
- Wen-Shan LEE
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250133802
- Publication date Apr 24, 2025
- Vanguard International Semiconductor Corporation
- Sheng-Wei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Out-of-Service Recovery Search Method and Out-of-Service Recovery S...
- Publication number 20250106743
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Jia-Hao Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250087535
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250038073
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Han SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250006834
- Publication date Jan 2, 2025
- Vanguard International Semiconductor Corporation
- Wen-Shan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240429315
- Publication date Dec 26, 2024
- Vanguard International Semiconductor Corporation
- Wen-Shan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...
- Publication number 20240412975
- Publication date Dec 12, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAFFIC PATTERN ADAPTIVE MODEM GEAR CONTROL FOR ELECTRONIC DEVICES
- Publication number 20240406873
- Publication date Dec 5, 2024
- MEDIATEK INC.
- Chung-Pi LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240387383
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240379437
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE USING DEHYDRATING CHEM...
- Publication number 20240379447
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUNG-CHIEH LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS
- Publication number 20240371770
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH INTER-WIRE CAVITIES
- Publication number 20240371779
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA STRUCTURES AND METHODS
- Publication number 20240339396
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM
- Publication number 20240314920
- Publication date Sep 19, 2024
- MEDIATEK INC.
- Tso-Ju YI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...
- Publication number 20240304534
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Shu-Wei HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP
- Publication number 20240282623
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240266391
- Publication date Aug 8, 2024
- Vanguard International Semiconductor Corporation
- Wen-Shan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ETCHING METALS IN SEMICONDUCTOR DEVICES
- Publication number 20240258117
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION TO A PARTIALLY FILLED TRENCH
- Publication number 20240213034
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT S...
- Publication number 20240194523
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...
- Publication number 20240178002
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME
- Publication number 20240178270
- Publication date May 30, 2024
- Vanguard International Semiconductor Corporation
- Wen-Shan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME
- Publication number 20240178315
- Publication date May 30, 2024
- Vanguard International Semiconductor Corporation
- Wen-Shan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240170544
- Publication date May 23, 2024
- Vanguard International Semiconductor Corporation
- Wen-Shan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240162109
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Chung-Lung Lee

Person

Patents Grantslast 30 patents

Method and structure of cut end with self-aligned double patterning

Self-assembled dielectric on metal rie lines to increase reliability

Packing lining

Packing lining

Methods of etching metals in semiconductor devices

Self-aligned interconnect structure

Method for forming a semiconductor structure using dehydrating chem...

Dielectric on wire structure to increase processing window for over...

Structure and method for an MRAM device with a multi-layer top elec...

Method and structure for semiconductor device having gate spacer pr...

Semiconductor structure etching solution and method for fabricating...

Semiconductor device with self-aligned conductive features

Magnetic tunnel junction devices

Interconnect conductive structure comprising two conductive materials

Method of using NC-MRA to generate pelvic veins images and measure...

Packaging box for bicycle

Integrated chip with an etch-stop layer forming a cavity

Structure and method for a low-k dielectric with pillar-type air-gaps

Double patterning approach by direct metal etch

Semiconductor structure and method for forming the same

Integrated chip with inter-wire cavities

Interconnection structure and methods of forming the same

Semiconductor arrangement and method of making

Interconnect structure having a barrier layer along the sidewall of...

Adjustment device switchable between a rotatable state or a locked...

Semiconductor device structure having air gap and method for formin...

Semiconductor package having improved thermal interface between sem...

Etch damage and ESL free dual damascene metal interconnect

Selective deposition of a protective layer to reduce interconnect s...

Via connection to a partially filled trench

Patents Applicationslast 30 patents

DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH

INTEGRATED CHIP WITH CAVITY STRUCTURE

Traffic Patterned-Based Modem Function Adjustment Method and System...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Out-of-Service Recovery Search Method and Out-of-Service Recovery S...

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...

TRAFFIC PATTERN ADAPTIVE MODEM GEAR CONTROL FOR ELECTRONIC DEVICES

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE USING DEHYDRATING CHEM...

INTERCONNECT CONDUCTIVE STRUCTURE COMPRISING TWO CONDUCTIVE MATERIALS

INTEGRATED CHIP WITH INTER-WIRE CAVITIES

SELF-ALIGNED VIA STRUCTURES AND METHODS

ELECTRONIC SYSTEM

THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...

SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHODS OF ETCHING METALS IN SEMICONDUCTOR DEVICES

VIA CONNECTION TO A PARTIALLY FILLED TRENCH

SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT S...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH REDUCED TRENCH DIST...

SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Package with Improved Heat Dissipation Efficiency and Method for Fo...