Chung Meng Lek

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit system with through silicon via and method of ma...
- Patent number 8,536,705
- Issue date Sep 17, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with through silicon via and method of ma...
- Patent number 8,236,688
- Issue date Aug 7, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture an integrated circuit system with through sil...
- Patent number 7,960,282
- Issue date Jun 14, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH THROUGH SILICON VIA AND METHOD OF MA...
- Publication number 20120205806
- Publication date Aug 16, 2012
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH THROUGH SILICON VIA AND METHOD OF MA...
- Publication number 20110237072
- Publication date Sep 29, 2011
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH THROUGH SILICON VIA AND METHOD OF MA...
- Publication number 20100297844
- Publication date Nov 25, 2010
- Chartered Semiconductor Manufacturing LTD.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS