Chung-Pang CHI

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive structure and method for forming the same
- Patent number 9,159,685
- Issue date Oct 13, 2015
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure and method for forming the same
- Patent number 8,872,336
- Issue date Oct 28, 2014
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure and method for forming the same
- Patent number 8,786,109
- Issue date Jul 22, 2014
- ChipMOS Technologies Inc.
- Chung-Pang Chi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bump structure and manufacturing method thereof
- Patent number 8,697,566
- Issue date Apr 15, 2014
- ChipMOS Technologies Inc.
- Chung-Pang Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure for a semiconductor integrated circuit and met...
- Patent number 8,319,337
- Issue date Nov 27, 2012
- ChipMOS Technologies Inc.
- Chung-Pang Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preventing tungsten plugs from corrosion
- Patent number 6,703,301
- Issue date Mar 9, 2004
- Macronix International Co., Ltd.
- Chen Chung Tai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20150011082
- Publication date Jan 8, 2015
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20130292821
- Publication date Nov 7, 2013
- CHIPMOS TECHNOLOGIES INC.
- Chung-Pang Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20130127047
- Publication date May 23, 2013
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120153460
- Publication date Jun 21, 2012
- CHIPMOS TECHNOLOGIES INC.
- Chung-Pang Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20080078995
- Publication date Apr 3, 2008
- CHIPMOS TECHNOLGIES INC.
- CHUNG-PANG CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of preventing tungsten plugs from corrosion
- Publication number 20030203625
- Publication date Oct 30, 2003
- Chen Chung Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lithographic and etching process using a hardened photoresist layer
- Publication number 20020039704
- Publication date Apr 4, 2002
- Kuen Sane Din
- H01 - BASIC ELECTRIC ELEMENTS

Chung-Pang CHI

Person

Patents Grantslast 30 patents

Conductive structure and method for forming the same

Conductive structure and method for forming the same

Conductive structure and method for forming the same

Bump structure and manufacturing method thereof

Conductive structure for a semiconductor integrated circuit and met...

Method of preventing tungsten plugs from corrosion

Patents Applicationslast 30 patents

CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME

CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME

CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME

BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP STRUCTURE

Method of preventing tungsten plugs from corrosion

Lithographic and etching process using a hardened photoresist layer