Chung Sheung YUNG

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Die bond head apparatus with die holder motion table
- Patent number 11,776,930
- Issue date Oct 3, 2023
- ASMPT SINGAPORE PTE. LTD.
- Chung Sheung Yung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-precision bond head positioning method and apparatus
- Patent number 10,861,819
- Issue date Dec 8, 2020
- ASM Technology Singapore Pte. Ltd.
- Jiangwen Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Active damping device for a positioning stage
- Patent number 7,649,333
- Issue date Jan 19, 2010
- ASM Assembly Automation LTD
- Ping Kong Joseph Choy
- G05 - CONTROLLING REGULATING
Information Patent Grant
Driver for an ultrasonic transducer and an ultrasonic transducer
- Patent number 7,462,960
- Issue date Dec 9, 2008
- The Hong Kong Polytechnic University
- Siu Wing Or
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE BOND HEAD APPARATUS WITH DIE HOLDER MOTION TABLE
- Publication number 20210183809
- Publication date Jun 17, 2021
- ASM Technology Singapore Pte Ltd
- Chung Sheung YUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE DAMPING DEVICE FOR A POSITIONING STAGE
- Publication number 20080169781
- Publication date Jul 17, 2008
- Ping Kong Joseph CHOY
- G05 - CONTROLLING REGULATING