Chung-Shi Liu

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Tervuren, BE

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Patents Grantslast 30 patents

Information Patent Grant
Method for transferring a graphene sheet to metal contact bumps of...
- Patent number 8,974,617
- Issue date Mar 10, 2015
- IMEC
- Yu-Hsiang Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for bonding semiconductor substrates and devices obtained th...
- Patent number 8,912,044
- Issue date Dec 16, 2014
- IMEC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and manufacturing method of copper germanide and...
- Patent number 7,858,519
- Issue date Dec 28, 2010
- IMEC
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...
- Publication number 20140170813
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...
- Publication number 20140166194
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COPPER CONTACT
- Publication number 20100207177
- Publication date Aug 19, 2010
- IMEC
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD OF COPPER GERMANIDE AND...
- Publication number 20090134521
- Publication date May 28, 2009
- Interuniversitair Microelektronica Centrum vzw
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS