Chung-Yi Weng

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Structures and process flow for integrated photonic-electric ic pac...
- Patent number 12,181,722
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hao Chen
- G02 - OPTICS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having prism structure and manufacturing method thereof
- Patent number 12,164,158
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Grant
Semiconductor package
- Patent number 12,105,323
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 12,040,283
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,947,173
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Audio mixing device and audio mixing method
- Patent number 11,830,523
- Issue date Nov 28, 2023
- Realtek Semiconductor Corporation
- Chung-Hui Weng
- G11 - INFORMATION STORAGE
Information Patent Grant
Photonic integrated circuit and package structure
- Patent number 11,809,000
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical interconnect structure, package structure and fabricating m...
- Patent number 11,768,338
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor device including optical through via and method of ma...
- Patent number 11,754,794
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- G02 - OPTICS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,754,780
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Structures and process flow for integrated photonic-electric IC pac...
- Patent number 11,740,415
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hao Chen
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,686,908
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 11,664,325
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,640,935
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Package and method of forming same
- Patent number 11,635,566
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,614,592
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having photonic and electronic dies and an opt...
- Patent number 11,506,843
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 11,244,906
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for image editing
- Patent number 9,336,583
- Issue date May 10, 2016
- Cyberlink Corp.
- Ho-Chao Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for tracking an object in a video
- Patent number 8,867,789
- Issue date Oct 21, 2014
- Cyberlink Corp.
- Huan-Wen Hsiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for improving object detection
- Patent number 8,769,409
- Issue date Jul 1, 2014
- Cyberlink Corp.
- Chung-Yi Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for selecting an object boundary in an image
- Patent number 8,761,519
- Issue date Jun 24, 2014
- Cyberlink Corp.
- Ming-Hsiu Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for performing facial detection
- Patent number 8,693,739
- Issue date Apr 8, 2014
- Cyberlink Corp.
- Chung-Yi Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for tagging photos
- Patent number 8,649,602
- Issue date Feb 11, 2014
- Cyberlink Corporation
- Shih-Min Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of browsing photos based on people
- Patent number 8,531,478
- Issue date Sep 10, 2013
- CyberLink Corp.
- Chi-Ming Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method of grouping images by face
- Patent number 8,121,358
- Issue date Feb 21, 2012
- CyberLink Corp.
- Chung-Yi Weng
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240385370
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240369759
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240321765
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240210636
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20240192456
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240178090
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178120
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240069277
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE
- Publication number 20240012213
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA...
- Publication number 20230384537
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- G02 - OPTICS
Information Patent Application
STRUCTURES AND PROCESS FLOW FOR INTEGRATED PHOTONIC-ELECTRIC IC PAC...
- Publication number 20230384538
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hao CHEN
- G02 - OPTICS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230378140
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230367062
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20230280558
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20230275030
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230266528
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...
- Publication number 20230258881
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
LOW RANDOM TELEGRAPH NOISE DEVICE
- Publication number 20230261087
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20230245967
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230236372
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230152542
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PACKAGE HAVING PRISM STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230066363
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230060720
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230018511
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF MA...
- Publication number 20220381999
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL INTERCONNECT STRUCTURE, PACKAGE STRUCTURE AND FABRICATING M...
- Publication number 20220382004
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220365273
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PHOTONIC AND ELECTRONIC DIES AND AN OPT...
- Publication number 20220365286
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
STRUCTURES AND PROCESS FLOW FOR INTEGRATED PHOTONIC-ELECTRIC IC PAC...
- Publication number 20220365294
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hao CHEN
- G02 - OPTICS

Chung-Yi Weng

Person

Patents Grantslast 30 patents

Structures and process flow for integrated photonic-electric ic pac...

Manufacturing method of semiconductor package

Package having prism structure and manufacturing method thereof

Semiconductor package

Method of fabricating semiconductor structure

Package structure

Photonic semiconductor device and method of manufacture

Semiconductor package and method of fabricating the same

Audio mixing device and audio mixing method

Photonic integrated circuit and package structure

Optical interconnect structure, package structure and fabricating m...

Semiconductor device including optical through via and method of ma...

Semiconductor package and manufacturing method thereof

Structures and process flow for integrated photonic-electric IC pac...

Photonic semiconductor device and method of manufacture

Semiconductor structure and method of fabricating the same

Semiconductor package and manufacturing method thereof

Package and method of forming same

Semiconductor devices and methods of manufacture

Semiconductor device having photonic and electronic dies and an opt...

Semiconductor structure and method of fabricating the same

Systems and methods for image editing

Systems and methods for tracking an object in a video

Systems and methods for improving object detection

System and method for selecting an object boundary in an image

Systems and methods for performing facial detection

Systems and methods for tagging photos

Method of browsing photos based on people

Method of grouping images by face

Patents Applicationslast 30 patents

PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

Photonic Semiconductor Device and Method of Manufacture

PACKAGE STRUCTURE

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE

METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA...

STRUCTURES AND PROCESS FLOW FOR INTEGRATED PHOTONIC-ELECTRIC IC PAC...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Photonic Semiconductor Device and Method of Manufacture

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

PACKAGE AND METHOD OF FORMING SAME

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...

LOW RANDOM TELEGRAPH NOISE DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Semiconductor Devices and Methods of Manufacture

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PACKAGE HAVING PRISM STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF MA...

OPTICAL INTERCONNECT STRUCTURE, PACKAGE STRUCTURE AND FABRICATING M...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING PHOTONIC AND ELECTRONIC DIES AND AN OPT...

STRUCTURES AND PROCESS FLOW FOR INTEGRATED PHOTONIC-ELECTRIC IC PAC...