Chunho Kim

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Feedthrough assembly and device including same
- Patent number 12,220,590
- Issue date Feb 11, 2025
- Medtronic, Inc.
- Andrew J. Ries
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Laser cutting system
- Patent number 11,999,014
- Issue date Jun 4, 2024
- Medtronic, Inc.
- Xiangnan He
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assembly for implantable medical device
- Patent number 11,883,673
- Issue date Jan 30, 2024
- Medtronic, Inc.
- Andrew J. Ries
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of forming integrated circuit package
- Patent number 11,876,026
- Issue date Jan 16, 2024
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component and method of forming same
- Patent number 11,756,741
- Issue date Sep 12, 2023
- Medtronic, Inc.
- Mark R. Boone
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Feedthrough assembly and device including same
- Patent number 11,633,611
- Issue date Apr 25, 2023
- Medtronic, Inc.
- Andrew J. Ries
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,569,178
- Issue date Jan 31, 2023
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,270,920
- Issue date Mar 8, 2022
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,031,345
- Issue date Jun 8, 2021
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for encapsulating a hybrid assembly of electronic component...
- Patent number 10,201,094
- Issue date Feb 5, 2019
- Medtronic, Inc.
- Chunho Kim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Self alignment features for an electronic assembly
- Patent number 7,569,939
- Issue date Aug 4, 2009
- Intel Corporation
- Viren V. Khandekar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self alignment features for an electronic assembly
- Patent number 7,482,199
- Issue date Jan 27, 2009
- Intel Corporation
- Viren V. Khandekar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self alignment features for an electronic assembly
- Patent number 7,135,771
- Issue date Nov 14, 2006
- Intel Corporation
- Viren V. Khandekar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE
- Publication number 20240165416
- Publication date May 23, 2024
- Medtronic, Inc.
- Andrew J. Ries
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145322
- Publication date May 2, 2024
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF FORMING SAME
- Publication number 20230420191
- Publication date Dec 28, 2023
- Medtronic, Inc.
- Mark R. Boone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDTHROUGH ASSEMBLY AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME
- Publication number 20230248982
- Publication date Aug 10, 2023
- Medtronic, Inc.
- Andrew J. Ries
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME
- Publication number 20230218911
- Publication date Jul 13, 2023
- Medtronic, Inc.
- Andrew J. Ries
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20220157676
- Publication date May 19, 2022
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF FORMING SAME
- Publication number 20220037092
- Publication date Feb 3, 2022
- Medtronic, Inc.
- Mark R. Boone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20210272909
- Publication date Sep 2, 2021
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME
- Publication number 20210187307
- Publication date Jun 24, 2021
- Medtronic, Inc.
- Andrew J. Ries
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LASER CUTTING SYSTEM
- Publication number 20210154772
- Publication date May 27, 2021
- Medtronic, Inc.
- Xiangnan He
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE
- Publication number 20210121705
- Publication date Apr 29, 2021
- Medtronic, Inc.
- Andrew J. Ries
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF FORMING SAME
- Publication number 20200154567
- Publication date May 14, 2020
- Medtronic, Inc.
- Chunho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY AND METHOD OF FORMING SAME
- Publication number 20200111765
- Publication date Apr 9, 2020
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20200058567
- Publication date Feb 20, 2020
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20200058592
- Publication date Feb 20, 2020
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR ENCAPSULATING A HYBRID ASSEMBLY OF ELECTRONIC COMPONENT...
- Publication number 20150342060
- Publication date Nov 26, 2015
- Medtronic, Inc.
- Chunho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Passive placement in wire-bonded microelectronics
- Publication number 20080093723
- Publication date Apr 24, 2008
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNMENT FEATURES FOR AN ELECTRONIC ASSEMBLY
- Publication number 20070020911
- Publication date Jan 25, 2007
- Intel Corporation
- Viren Khandekar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SELF ALIGNMENT FEATURES FOR AN ELECTRONIC ASSEMBLY
- Publication number 20070013063
- Publication date Jan 18, 2007
- Intel Corporation
- Viren V. Khandekar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Person

Patents Grantslast 30 patents

Feedthrough assembly and device including same

Laser cutting system

Electronics assembly for implantable medical device

Method of forming integrated circuit package

Electrical component and method of forming same

Feedthrough assembly and device including same

Integrated circuit package and method of forming same

Integrated circuit package and method of forming same

Integrated circuit package and method of forming same

Systems for encapsulating a hybrid assembly of electronic component...

Self alignment features for an electronic assembly

Self alignment features for an electronic assembly

Self alignment features for an electronic assembly

Patents Applicationslast 30 patents

ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

FEEDTHROUGH ASSEMBLY AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME

LASER CUTTING SYSTEM

ELECTRONICS ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

ELECTRONIC ASSEMBLY AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SYSTEMS FOR ENCAPSULATING A HYBRID ASSEMBLY OF ELECTRONIC COMPONENT...

Passive placement in wire-bonded microelectronics

SELF ALIGNMENT FEATURES FOR AN ELECTRONIC ASSEMBLY

SELF ALIGNMENT FEATURES FOR AN ELECTRONIC ASSEMBLY