Chunhui DOU

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Patents Grantslast 30 patents

Information Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
- Patent number 11,781,233
- Issue date Oct 10, 2023
- Ebara Corporation
- Junitsu Yamakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
- Patent number 11,767,606
- Issue date Sep 26, 2023
- Ebara Corporation
- Junitsu Yamakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
- Patent number 11,230,780
- Issue date Jan 25, 2022
- Ebara Corporation
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...
- Publication number 20220074065
- Publication date Mar 10, 2022
- EBARA CORPORATION
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...
- Publication number 20220074064
- Publication date Mar 10, 2022
- EBARA CORPORATION
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRO...
- Publication number 20210180202
- Publication date Jun 17, 2021
- EBARA CORPORATION
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR SUPPLYING PLATING SOLUTION TO PLATING TANK...
- Publication number 20170226656
- Publication date Aug 10, 2017
- EBARA CORPORATION
- Chunhui DOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR