Chunlei LIU

Person

Zurich, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor package with highly reliable chip topside
- Patent number 11,538,734
- Issue date Dec 27, 2022
- Hitachi Energy Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor module by using adhesive attac...
- Patent number 11,348,896
- Issue date May 31, 2022
- Audi AG
- Chunlei Liu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Manufacturing of a power semiconductor module
- Patent number 11,189,556
- Issue date Nov 30, 2021
- ABB Power Grids Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with active short circuit failure mode
- Patent number 11,056,408
- Issue date Jul 6, 2021
- ABB Power Grids Switzerland AG
- Chunlei Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor module with short circuit failure mode
- Patent number 10,872,830
- Issue date Dec 22, 2020
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module based on normally-on semiconductor switches
- Patent number 10,797,586
- Issue date Oct 6, 2020
- ABB Schweiz AG
- Uwe Drofenik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-electronic arrangement
- Patent number 8,405,992
- Issue date Mar 26, 2013
- ABB Research Ltd.
- Berk Yesin
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Power Module and Method for Producing a Power Module
- Publication number 20240030101
- Publication date Jan 25, 2024
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACT ARRANGEMENT, POWER SEMICONDUCTOR MODULE, METHOD...
- Publication number 20230343715
- Publication date Oct 26, 2023
- Hitachi Energy Switzerland AG
- Juergen SCHUDERER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20230335472
- Publication date Oct 19, 2023
- Hitachi Energy Switzerland AG
- Juergen SCHUDERER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module Device with an Embedded Power Semiconductor Device
- Publication number 20230112582
- Publication date Apr 13, 2023
- Hitachi Energy Switzerland AG
- Slavo Kicin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Accessible Metal Clips
- Publication number 20230048878
- Publication date Feb 16, 2023
- Hitachi Energy Switzerland AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Highly Reliable Chip Topside
- Publication number 20210104449
- Publication date Apr 8, 2021
- ABB Power Grids Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BASED ON NORMALLY-ON SEMICONDUCTOR SWITCHES
- Publication number 20200059155
- Publication date Feb 20, 2020
- ABB Schweiz AG
- Uwe Drofenik
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH ACTIVE SHORT CIRCUIT FAILURE MODE
- Publication number 20190355633
- Publication date Nov 21, 2019
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH SHORT CIRCUIT FAILURE MODE
- Publication number 20190355634
- Publication date Nov 21, 2019
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING OF A POWER SEMICONDUCTOR MODULE
- Publication number 20190273040
- Publication date Sep 5, 2019
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160079156
- Publication date Mar 17, 2016
- ABB Technology Oy
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMI...
- Publication number 20120211799
- Publication date Aug 23, 2012
- ABB Research Ltd.
- Chunlei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MODULE
- Publication number 20110156094
- Publication date Jun 30, 2011
- ABB Research Ltd.
- Christoph Haederli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-ELECTRONIC ARRANGEMENT
- Publication number 20110080711
- Publication date Apr 7, 2011
- ABB Research Ltd.
- Berk YESIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FIXTURE APPARATUS FOR LOW-TEMPERATURE AND LOW-PRESSURE SINTERING
- Publication number 20100224674
- Publication date Sep 9, 2010
- ABB Research Ltd.
- Chunlei LIU
- B22 - CASTING POWDER METALLURGY

Chunlei LIU

Person

Patents Grantslast 30 patents

Power semiconductor package with highly reliable chip topside

Method for producing a semiconductor module by using adhesive attac...

Manufacturing of a power semiconductor module

Power semiconductor device with active short circuit failure mode

Power semiconductor module with short circuit failure mode

Power module based on normally-on semiconductor switches

Power-electronic arrangement

Patents Applicationslast 30 patents

Power Module and Method for Producing a Power Module

ELECTRICAL CONTACT ARRANGEMENT, POWER SEMICONDUCTOR MODULE, METHOD...

POWER SEMICONDUCTOR MODULE

Power Module Device with an Embedded Power Semiconductor Device

Power Semiconductor Module with Accessible Metal Clips

Power Semiconductor Package with Highly Reliable Chip Topside

POWER MODULE BASED ON NORMALLY-ON SEMICONDUCTOR SWITCHES

POWER SEMICONDUCTOR DEVICE WITH ACTIVE SHORT CIRCUIT FAILURE MODE

POWER SEMICONDUCTOR MODULE WITH SHORT CIRCUIT FAILURE MODE

MANUFACTURING OF A POWER SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMI...

ELECTRICAL MODULE

POWER-ELECTRONIC ARRANGEMENT

FIXTURE APPARATUS FOR LOW-TEMPERATURE AND LOW-PRESSURE SINTERING