Chunlei ZHANG

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metrology slot plates
- Patent number 12,057,333
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Kenneth Brian Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission corrected plasma emission using in-situ optical reflec...
- Patent number 12,031,910
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Patrick Tae
- G01 - MEASURING TESTING
Information Patent Grant
High power electrostatic chuck design with radio frequency coupling
- Patent number 11,948,826
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced temperature control for wafer carrier in plasma processing...
- Patent number 11,837,479
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Fernando M. Silveira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Azimuthally tunable multi-zone electrostatic chuck
- Patent number 11,622,419
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Chunlei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power electrostatic chuck design with radio frequency coupling
- Patent number 11,532,497
- Issue date Dec 20, 2022
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for etching semiconductor structures
- Patent number 11,164,723
- Issue date Nov 2, 2021
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece carrier for high power with enhanced edge sealing
- Patent number 11,127,619
- Issue date Sep 21, 2021
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for etching semiconductor structures
- Patent number 10,930,471
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck assembly having a dielectric filler
- Patent number 10,930,540
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feedforward temperature control for plasma processing apparatus
- Patent number 10,854,425
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Chetan Mahadeswaraswamy
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and apparatus for de-chucking a workpiece using a swing volt...
- Patent number 10,784,132
- Issue date Sep 22, 2020
- Applied Materials, Inc.
- Haitao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power electrostatic chuck with aperture-reducing plug in a gas...
- Patent number 10,770,270
- Issue date Sep 8, 2020
- Applied Materials, Inc.
- Jaeyong Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Showerhead with reduced backside plasma ignition
- Patent number 10,745,807
- Issue date Aug 18, 2020
- Applied Materials, Inc.
- Haitao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Real-time measurement of a surface charge profile of an electrostat...
- Patent number 10,656,194
- Issue date May 19, 2020
- Applied Materials, Inc.
- Haitao Wang
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for etching semiconductor structures
- Patent number 10,593,518
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck assembly having a dielectric filler
- Patent number 10,504,765
- Issue date Dec 10, 2019
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Azimuthally tunable multi-zone electrostatic chuck
- Patent number 10,440,777
- Issue date Oct 8, 2019
- Applied Materials, Inc.
- Chunlei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for electrical and magnetic uniformity and skew...
- Patent number 10,410,889
- Issue date Sep 10, 2019
- Applied Materials, Inc.
- S. M. Reza Sadjadi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Showerhead with reduced backside plasma ignition
- Patent number 10,378,108
- Issue date Aug 13, 2019
- Applied Materials, Inc.
- Haitao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for de-chucking a workpiece using a swing volt...
- Patent number 10,242,893
- Issue date Mar 26, 2019
- Applied Materials, Inc.
- Haitao Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Tunable magnetic field to improve uniformity
- Patent number 9,646,843
- Issue date May 9, 2017
- Applied Materials, Inc.
- Andrew Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Feedforward temperature control for plasma processing apparatus
- Patent number 9,338,871
- Issue date May 10, 2016
- Applied Materials, Inc.
- Chetan Mahadeswaraswamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for rapidly responsive heat control in plasma...
- Patent number 9,155,134
- Issue date Oct 6, 2015
- Applied Materials, Inc.
- Chunlei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for rapidly responsive heat control in plasma...
- Patent number 8,895,889
- Issue date Nov 25, 2014
- Applied Materials, Inc.
- Chunlei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for tuning matching networks
- Patent number 8,513,889
- Issue date Aug 20, 2013
- Applied Materials, Inc.
- Chunlei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for gas flow measurement
- Patent number 7,975,558
- Issue date Jul 12, 2011
- Applied Materials, Inc.
- Jared Ahmad Lee
- G01 - MEASURING TESTING
Information Patent Grant
Method of controlling process parameters for semiconductor manufact...
- Patent number 7,848,840
- Issue date Dec 7, 2010
- Applied Materials, Inc.
- Ritchie Dao
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and apparatus for gas flow measurement
- Patent number 7,743,670
- Issue date Jun 29, 2010
- Applied Materials, Inc.
- Jared Ahmed Lee
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METROLOGY SLOT PLATES
- Publication number 20250014922
- Publication date Jan 9, 2025
- Applied Materials Inc.
- Kenneth Brian Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION CORRECTED PLASMA EMISSION USING IN-SITU OPTICAL REFLEC...
- Publication number 20240361239
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Patrick Tae
- G01 - MEASURING TESTING
Information Patent Application
ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING...
- Publication number 20240047246
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Fernando M. Silveira
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ESTIMATION OF CHAMBER COMPONENT CONDITIONS USING SUBSTRATE MEASUREM...
- Publication number 20230236569
- Publication date Jul 27, 2023
- Applied Materials, Inc.
- Chunlei Zhang
- G05 - CONTROLLING REGULATING
Information Patent Application
CHAMBER COMPONENT CONDITION ESTIMATION USING SUBSTRATE MEASUREMENTS
- Publication number 20230236583
- Publication date Jul 27, 2023
- Applied Materials, Inc.
- Chunlei Zhang
- G05 - CONTROLLING REGULATING
Information Patent Application
SUBSTRATE SUPPORT CHARACTERIZATION TO BUILD A DIGITAL TWIN
- Publication number 20230195060
- Publication date Jun 22, 2023
- Applied Materials, Inc.
- Vivek Bharat Shah
- G05 - CONTROLLING REGULATING
Information Patent Application
METHODS AND MECHANISMS FOR ADJUSTING PROCESS CHAMBER PARAMETERS DUR...
- Publication number 20230195078
- Publication date Jun 22, 2023
- Applied Materials, Inc.
- Chunlei Zhang
- G05 - CONTROLLING REGULATING
Information Patent Application
METHODS AND MECHANISMS FOR COUPLING SENSORS TO TRANSFER CHAMBER ROBOT
- Publication number 20230089982
- Publication date Mar 23, 2023
- Applied Materials, Inc.
- Phillip Criminale
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSMISSION CORRECTED PLASMA EMISSION USING IN-SITU OPTICAL REFLEC...
- Publication number 20230078567
- Publication date Mar 16, 2023
- Applied Materials, Inc.
- Patrick Tae
- G01 - MEASURING TESTING
Information Patent Application
HIGH POWER ELECTROSTATIC CHUCK DESIGN WITH RADIO FREQUENCY COUPLING
- Publication number 20230072594
- Publication date Mar 9, 2023
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METROLOGY SLOT PLATES
- Publication number 20230076170
- Publication date Mar 9, 2023
- Applied Materials, Inc.
- Kenneth Brian Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MECHANISM FOR CONTACT-FREE PROCESS CHAMBER CHARACTERIZATION
- Publication number 20230008072
- Publication date Jan 12, 2023
- Applied Materials, Inc.
- Vivek B. Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220130642
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- Katsumasa KAWASAKI
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20210351021
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Fernando SILVEIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES
- Publication number 20210142987
- Publication date May 13, 2021
- Applied Materials, Inc.
- DAISUKE SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIZONE FLOW DISTRIBUTION SYSTEM
- Publication number 20200312680
- Publication date Oct 1, 2020
- Applied Materials Inc.
- DAISUKE SHIMIZU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES
- Publication number 20200294771
- Publication date Sep 17, 2020
- Applied Materials, Inc.
- DAISUKE SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK ASSEMBLY HAVING A DIELECTRIC FILLER
- Publication number 20200066566
- Publication date Feb 27, 2020
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AZIMUTHALLY TUNABLE MULTI-ZONE ELECTROSTATIC CHUCK
- Publication number 20200037399
- Publication date Jan 30, 2020
- Applied Materials, Inc.
- Chunlei ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHOWERHEAD WITH REDUCED BACKSIDE PLASMA IGNITION
- Publication number 20190271082
- Publication date Sep 5, 2019
- Applied Materials, Inc.
- Haitao WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR DE-CHUCKING A WORKPIECE USING A SWING VOLT...
- Publication number 20190189481
- Publication date Jun 20, 2019
- Applied Materials, Inc.
- Haitao Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD AND APPARATUS FOR DE-CHUCKING A WORKPIECE USING A SWING VOLT...
- Publication number 20180366359
- Publication date Dec 20, 2018
- Applied Materials, Inc.
- Haitao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO MODULATE THE WAFER EDGE SHEATH IN A PLASMA PROCESSING CHA...
- Publication number 20180323042
- Publication date Nov 8, 2018
- Applied Materials, Inc.
- Haitao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic Chuck Assembly Having A Dielectric Filler
- Publication number 20180308736
- Publication date Oct 25, 2018
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI CHAMBER PROCESSING SYSTEM WITH SHARED VACUUM SYSTEM
- Publication number 20180061679
- Publication date Mar 1, 2018
- Applied Materials, Inc.
- Fernando M. SILVEIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE CARRIER FOR HIGH POWER WITH ENHANCED EDGE SEALING
- Publication number 20170352566
- Publication date Dec 7, 2017
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER ELECTROSTATIC CHUCK DESIGN WITH RADIO FREQUENCY COUPLING
- Publication number 20170352567
- Publication date Dec 7, 2017
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WORKPIECE CARRIER WITH GAS PRESSURE IN INNER CAVITIES
- Publication number 20170352565
- Publication date Dec 7, 2017
- Chunlei Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH POWER ELECTROSTATIC CHUCK WITH APERTURE-REDUCING PLUG IN A GAS...
- Publication number 20170352568
- Publication date Dec 7, 2017
- Jaeyong Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING...
- Publication number 20170323813
- Publication date Nov 9, 2017
- Fernando M. Silveira
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Chunlei ZHANG

Person

Patents Grantslast 30 patents

Metrology slot plates

Transmission corrected plasma emission using in-situ optical reflec...

High power electrostatic chuck design with radio frequency coupling

Advanced temperature control for wafer carrier in plasma processing...

Azimuthally tunable multi-zone electrostatic chuck

High power electrostatic chuck design with radio frequency coupling

Methods and apparatus for etching semiconductor structures

Workpiece carrier for high power with enhanced edge sealing

Methods and apparatus for etching semiconductor structures

Electrostatic chuck assembly having a dielectric filler

Feedforward temperature control for plasma processing apparatus

Method and apparatus for de-chucking a workpiece using a swing volt...

High power electrostatic chuck with aperture-reducing plug in a gas...

Showerhead with reduced backside plasma ignition

Real-time measurement of a surface charge profile of an electrostat...

Methods and apparatus for etching semiconductor structures

Electrostatic chuck assembly having a dielectric filler

Azimuthally tunable multi-zone electrostatic chuck

Systems and methods for electrical and magnetic uniformity and skew...

Showerhead with reduced backside plasma ignition

Method and apparatus for de-chucking a workpiece using a swing volt...

Tunable magnetic field to improve uniformity

Feedforward temperature control for plasma processing apparatus

Methods and apparatus for rapidly responsive heat control in plasma...

Methods and apparatus for rapidly responsive heat control in plasma...

Methods and apparatus for tuning matching networks

Method and apparatus for gas flow measurement

Method of controlling process parameters for semiconductor manufact...

Method and apparatus for gas flow measurement

Patents Applicationslast 30 patents

METROLOGY SLOT PLATES

TRANSMISSION CORRECTED PLASMA EMISSION USING IN-SITU OPTICAL REFLEC...

ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING...

ESTIMATION OF CHAMBER COMPONENT CONDITIONS USING SUBSTRATE MEASUREM...

CHAMBER COMPONENT CONDITION ESTIMATION USING SUBSTRATE MEASUREMENTS

SUBSTRATE SUPPORT CHARACTERIZATION TO BUILD A DIGITAL TWIN

METHODS AND MECHANISMS FOR ADJUSTING PROCESS CHAMBER PARAMETERS DUR...

METHODS AND MECHANISMS FOR COUPLING SENSORS TO TRANSFER CHAMBER ROBOT

TRANSMISSION CORRECTED PLASMA EMISSION USING IN-SITU OPTICAL REFLEC...

HIGH POWER ELECTROSTATIC CHUCK DESIGN WITH RADIO FREQUENCY COUPLING

METROLOGY SLOT PLATES

METHOD AND MECHANISM FOR CONTACT-FREE PROCESS CHAMBER CHARACTERIZATION

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES

MULTIZONE FLOW DISTRIBUTION SYSTEM

METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES

ELECTROSTATIC CHUCK ASSEMBLY HAVING A DIELECTRIC FILLER

AZIMUTHALLY TUNABLE MULTI-ZONE ELECTROSTATIC CHUCK

SHOWERHEAD WITH REDUCED BACKSIDE PLASMA IGNITION

METHOD AND APPARATUS FOR DE-CHUCKING A WORKPIECE USING A SWING VOLT...

METHOD AND APPARATUS FOR DE-CHUCKING A WORKPIECE USING A SWING VOLT...

METHOD TO MODULATE THE WAFER EDGE SHEATH IN A PLASMA PROCESSING CHA...

Electrostatic Chuck Assembly Having A Dielectric Filler

MULTI CHAMBER PROCESSING SYSTEM WITH SHARED VACUUM SYSTEM

WORKPIECE CARRIER FOR HIGH POWER WITH ENHANCED EDGE SEALING

HIGH POWER ELECTROSTATIC CHUCK DESIGN WITH RADIO FREQUENCY COUPLING

WORKPIECE CARRIER WITH GAS PRESSURE IN INNER CAVITIES

HIGH POWER ELECTROSTATIC CHUCK WITH APERTURE-REDUCING PLUG IN A GAS...

ADVANCED TEMPERATURE CONTROL FOR WAFER CARRIER IN PLASMA PROCESSING...