Chunming ZHOU

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and chamber for backside physical vapor deposition
- Patent number 12,176,205
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Chunming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and chamber for backside physical vapor deposition
- Patent number 12,142,478
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Chunming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low resistivity and stress tungsten gap fill
- Patent number 12,094,773
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for low resistivity and stress tungsten gap fill
- Patent number 11,798,845
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and chamber for backside physical vapor deposition
- Patent number 11,572,618
- Issue date Feb 7, 2023
- Applied Materials, Inc.
- Jothilingam Ramalingam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and chamber for backside physical vapor deposition
- Patent number 11,469,096
- Issue date Oct 11, 2022
- Applied Materials, Inc.
- Chunming Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND CHAMBER FOR BACKSIDE PHYSICAL VAPOR DEPOSITION
- Publication number 20230335393
- Publication date Oct 19, 2023
- Applied Materials, Inc.
- Chunming ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CHAMBER FOR BACKSIDE PHYSICAL VAPOR DEPOSITION
- Publication number 20220415649
- Publication date Dec 29, 2022
- Applied Materials, Inc.
- Chunming ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL
- Publication number 20220336274
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL
- Publication number 20220130724
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low Resistivity Tungsten Film And Method Of Manufacture
- Publication number 20220068709
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Feihu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LOW RESISTANCE CONTACT INTERCONNECTION
- Publication number 20210123139
- Publication date Apr 29, 2021
- Applied Materials, Inc.
- Chunming ZHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND CHAMBER FOR BACKSIDE PHYSICAL VAPOR DEPOSITION
- Publication number 20210062325
- Publication date Mar 4, 2021
- Applied Materials, Inc.
- Jothilingam RAMALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CHAMBER FOR BACKSIDE PHYSICAL VAPOR DEPOSITION
- Publication number 20200350160
- Publication date Nov 5, 2020
- Applied Materials, Inc.
- Chunming ZHOU
- H01 - BASIC ELECTRIC ELEMENTS

Chunming ZHOU

Person

Patents Grantslast 30 patents

Method and chamber for backside physical vapor deposition

Method and chamber for backside physical vapor deposition

Methods for low resistivity and stress tungsten gap fill

Methods and apparatus for low resistivity and stress tungsten gap fill

Method and chamber for backside physical vapor deposition

Method and chamber for backside physical vapor deposition

Patents Applicationslast 30 patents

METHOD AND CHAMBER FOR BACKSIDE PHYSICAL VAPOR DEPOSITION

METHOD AND CHAMBER FOR BACKSIDE PHYSICAL VAPOR DEPOSITION

METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL

METHODS AND APPARATUS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL

Low Resistivity Tungsten Film And Method Of Manufacture

METHOD AND APPARATUS FOR LOW RESISTANCE CONTACT INTERCONNECTION

METHOD AND CHAMBER FOR BACKSIDE PHYSICAL VAPOR DEPOSITION

METHOD AND CHAMBER FOR BACKSIDE PHYSICAL VAPOR DEPOSITION