Chunyan Zhang

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Jiangsu, CN

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Patents Grantslast 30 patents

Information Patent Grant
First-etched and later-packaged three-dimensional system-in-package...
- Patent number 9,633,985
- Issue date Apr 25, 2017
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Chih-Chung Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIRST-ETCHED AND LATER-PACKAGED THREE-DIMENSIONAL SYSTEM-IN-PACKAGE...
- Publication number 20160372450
- Publication date Dec 22, 2016
- JIANGSU CHANGJANG ELECTRONICS, TECHNOLOGY CO., LTD
- Chih-Chung Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST-PACKAGED AND LATER-ETCHED THREE-DIMENSIONAL FLIP-CHIP SYSTEM-...
- Publication number 20160148861
- Publication date May 26, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
- Chih-Chung Liang
- H01 - BASIC ELECTRIC ELEMENTS