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Chuzo Azuma
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Aizuwakamatsu, JP
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last 30 patents
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Patent Grant
Lead frame material and lead frame for semiconductor device
Patent number
5,510,197
Issue date
Apr 23, 1996
Mitsubishi Shindoh Co., Ltd.
Shunji Takahashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...