Chyi Shyuam Chern

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method to form copper interconnects by adding an aluminum layer to...
- Patent number 6,740,580
- Issue date May 25, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Subhash Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pre-heat pressure CVD TiN process
- Patent number 6,403,478
- Issue date Jun 11, 2002
- Chartered Semiconductor Manufacturing Company
- Chim-Seng Seet
- H01 - BASIC ELECTRIC ELEMENTS