Chyi-Tsong Ni

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Device and methods for chemical vapor deposition
- Patent number 12,276,024
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Tsun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
- Patent number 12,205,921
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for semiconductor wafer
- Patent number 12,194,510
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- B08 - CLEANING
Information Patent Grant
Semiconductor processing tool and methods of operation
- Patent number 12,131,962
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method of manufacturing interconnect structures
- Patent number 12,091,752
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Ting Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition bonding layer for joining two semiconductor...
- Patent number 12,094,849
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing tool
- Patent number 12,084,769
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Tsun Liu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
- Patent number 12,068,277
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure formation in a semiconductor device
- Patent number 12,068,363
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for humidity control of FOUP during semiconduct...
- Patent number 12,051,609
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Ju Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for physical vapor deposition
- Patent number 12,014,912
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Young Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for semiconductor wafer cleaning
- Patent number 11,938,521
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- B08 - CLEANING
Information Patent Grant
Reflector and/or method for ultraviolet curing of semiconductor
- Patent number 11,929,267
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorine-free interface for semiconductor device performance gain
- Patent number 11,908,909
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing tool
- Patent number 11,851,761
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Tsun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interface tool
- Patent number 11,854,851
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jyh-Shiou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication apparatus
- Patent number 11,735,436
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method and wafer bonding apparatus
- Patent number 11,721,662
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having a micro-battery and methods for mak...
- Patent number 11,695,150
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 11,670,547
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication apparatus
- Patent number 11,443,961
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorine-free interface for semiconductor device performance gain
- Patent number 11,437,477
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having a micro-battery and methods for mak...
- Patent number 11,101,491
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment tool
- Patent number 10,847,490
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Deep trench capacitor with scallop profile
- Patent number 10,692,966
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment tool
- Patent number 10,396,054
- Issue date Aug 27, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having a micro-battery and methods for mak...
- Patent number 10,361,449
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating micro electro mechanical system structures
- Patent number 9,776,857
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,650,243
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and fabricating process for the same
- Patent number 9,444,398
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chyi-Tsong Ni
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR SEMICONDUCTOR WAFER CLEANING
- Publication number 20250041906
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Cheng
- B08 - CLEANING
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING INTERCONNECT STRUCTURES
- Publication number 20240384408
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ting TSAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL
- Publication number 20240384416
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Tsun LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VENT PORT DIFFUSER
- Publication number 20240387200
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Tsun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION
- Publication number 20240384414
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Tsun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240379471
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240379548
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE
- Publication number 20240371921
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20240363578
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HUMIDITY CONTROL OF FOUP DURING SEMICONDUCT...
- Publication number 20240347363
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Ju Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PHYSICAL VAPOR DEPOSITION
- Publication number 20240339310
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Young WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REFLECTOR AND/OR METHOD FOR ULTRAVIOLET CURING OF SEMICONDUCTOR
- Publication number 20240234176
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chun Hu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
FLUORINE-FREE INTERFACE FOR SEMICONDUCTOR DEVICE PERFORMANCE GAIN
- Publication number 20240145561
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ting TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL
- Publication number 20240084454
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Tsun LIU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
INTERFACE TOOL
- Publication number 20240087935
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyh-Shiou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLECTOR AND/OR METHOD FOR ULTRAVIOLET CURING OF SEMICONDUCTOR
- Publication number 20240063035
- Publication date Feb 22, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Chien-Chun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SEMICONDUCTOR WAFER
- Publication number 20240001409
- Publication date Jan 4, 2024
- Kuang-Wei Cheng
- B08 - CLEANING
Information Patent Application
HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING
- Publication number 20230402427
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20230268227
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Ting TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION
- Publication number 20230257882
- Publication date Aug 17, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yung-Tsun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEFLECTOR FOR CHAMBER CLEANING
- Publication number 20230257875
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Cheng
- B08 - CLEANING
Information Patent Application
SYSTEMS AND METHODS FOR HUMIDITY CONTROL OF FOUP DURING SEMICONDUCT...
- Publication number 20230154778
- Publication date May 18, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Sung-Ju Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACVD SYSTEM AND METHOD FOR REDUCING OBSTRUCTIONS THEREIN
- Publication number 20230151484
- Publication date May 18, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kuang-Wei Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR SEMICONDUCTOR WAFER CLEANING
- Publication number 20230149980
- Publication date May 18, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kuang-Wei Cheng
- B08 - CLEANING
Information Patent Application
VENT PORT DIFFUSER
- Publication number 20230062038
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yung-Tsun LIU
- B08 - CLEANING
Information Patent Application
HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING
- Publication number 20230065793
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230069557
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE
- Publication number 20230036572
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20230026052
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FABRICATION APPARATUS
- Publication number 20220392782
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Tsung LEE
- H01 - BASIC ELECTRIC ELEMENTS

Chyi-Tsong Ni

Person

Patents Grantslast 30 patents

Device and methods for chemical vapor deposition

Heterogenous bonding layers for direct semiconductor bonding

Method and apparatus for semiconductor wafer

Semiconductor processing tool and methods of operation

Apparatus and method of manufacturing interconnect structures

Atomic layer deposition bonding layer for joining two semiconductor...

Semiconductor processing tool

Heterogenous bonding layers for direct semiconductor bonding

Structure formation in a semiconductor device

Systems and methods for humidity control of FOUP during semiconduct...

Apparatus and method for physical vapor deposition

Method and apparatus for semiconductor wafer cleaning

Reflector and/or method for ultraviolet curing of semiconductor

Fluorine-free interface for semiconductor device performance gain

Semiconductor processing tool

Interface tool

Semiconductor fabrication apparatus

Wafer bonding method and wafer bonding apparatus

Semiconductor structures having a micro-battery and methods for mak...

Semiconductor arrangement and method of making

Semiconductor fabrication apparatus

Fluorine-free interface for semiconductor device performance gain

Semiconductor structures having a micro-battery and methods for mak...

Bonding alignment tool

Deep trench capacitor with scallop profile

Bonding alignment tool

Semiconductor structures having a micro-battery and methods for mak...

Methods of fabricating micro electro mechanical system structures

Method and apparatus for a seal ring structure

Semiconductor structure and fabricating process for the same

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR SEMICONDUCTOR WAFER CLEANING

APPARATUS AND METHOD OF MANUFACTURING INTERCONNECT STRUCTURES

SEMICONDUCTOR PROCESSING TOOL

VENT PORT DIFFUSER

DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

SYSTEMS AND METHODS FOR HUMIDITY CONTROL OF FOUP DURING SEMICONDUCT...

APPARATUS AND METHOD FOR PHYSICAL VAPOR DEPOSITION

REFLECTOR AND/OR METHOD FOR ULTRAVIOLET CURING OF SEMICONDUCTOR

FLUORINE-FREE INTERFACE FOR SEMICONDUCTOR DEVICE PERFORMANCE GAIN

SEMICONDUCTOR PROCESSING TOOL

INTERFACE TOOL

REFLECTOR AND/OR METHOD FOR ULTRAVIOLET CURING OF SEMICONDUCTOR

METHOD AND APPARATUS FOR SEMICONDUCTOR WAFER

HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION

DEFLECTOR FOR CHAMBER CLEANING

SYSTEMS AND METHODS FOR HUMIDITY CONTROL OF FOUP DURING SEMICONDUCT...

SACVD SYSTEM AND METHOD FOR REDUCING OBSTRUCTIONS THEREIN

METHOD AND APPARATUS FOR SEMICONDUCTOR WAFER CLEANING

VENT PORT DIFFUSER

HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

SEMICONDUCTOR FABRICATION APPARATUS