Chytra PAWASHE

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stress compensation for wafer to wafer bonding
- Patent number 11,721,554
- Issue date Aug 8, 2023
- Intel Corporation
- Anant Jahagirdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing in-plane distortion from wafer to wafer bonding using a du...
- Patent number 11,195,719
- Issue date Dec 7, 2021
- Intel Corporation
- Chytra Pawashe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fin design to mitigate fin collapse
- Patent number 11,171,057
- Issue date Nov 9, 2021
- Intel Corporation
- Glenn A. Glass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid viscosity control during wafer bonding
- Patent number 11,056,356
- Issue date Jul 6, 2021
- Intel Corporation
- Brennen K. Mueller
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Display including an LED element having a pressure sensitive adhesi...
- Patent number 10,886,153
- Issue date Jan 5, 2021
- Intel Corporation
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding with low wafer distortion
- Patent number 10,720,345
- Issue date Jul 21, 2020
- Intel Corporation
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant layer for wafer to wafer bonding
- Patent number 10,707,186
- Issue date Jul 7, 2020
- Intel Corporation
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating MEMS structures with interconnects and vias
- Patent number 10,457,548
- Issue date Oct 29, 2019
- Intel Corporation
- Kevin Lai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Synthetic jet delivering controlled flow to sensor system
- Patent number 10,282,965
- Issue date May 7, 2019
- Intel Corporation
- Jessica Gullbrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro pick and bond assembly
- Patent number 10,242,892
- Issue date Mar 26, 2019
- Intel Corporation
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro pick and bond assembly
- Patent number 10,204,808
- Issue date Feb 12, 2019
- Intel Corporation
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire-based mechanical switching device
- Patent number 9,947,805
- Issue date Apr 17, 2018
- Intel Corporation
- Chytra Pawashe
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Magnetic nanomechanical devices for stiction compensation
- Patent number 9,926,193
- Issue date Mar 27, 2018
- Intel Corporation
- Jorge A. Munoz
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nanowire-based mechanical switching device
- Patent number 9,362,074
- Issue date Jun 7, 2016
- Intel Corporation
- Chytra Pawashe
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET
- Publication number 20240063143
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REDUCING PELLICLE RUPTURE
- Publication number 20230367204
- Publication date Nov 16, 2023
- Intel Corporation
- Lance C. HIBBELER
- G01 - MEASURING TESTING
Information Patent Application
THERMAL MANAGEMENT STRUCTURES IN SEMICONDUCTOR DEVICES AND METHODS...
- Publication number 20220415807
- Publication date Dec 29, 2022
- Intel Corporation
- Chytra Pawashe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS COMPENSATION FOR WAFER TO WAFER BONDING
- Publication number 20200303191
- Publication date Sep 24, 2020
- Intel Corporation
- Anant JAHAGIRDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FIN DESIGN TO MITIGATE FIN COLLAPSE
- Publication number 20200066595
- Publication date Feb 27, 2020
- Intel Corporation
- GLENN A. GLASS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING IN-PLANE DISTORTION FROM WAFER TO WAFER BONDING USING A DU...
- Publication number 20190304784
- Publication date Oct 3, 2019
- Intel Corporation
- Chytra PAWASHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO PICK AND BOND ASSEMBLY
- Publication number 20190148188
- Publication date May 16, 2019
- Intel Corporation
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING MEMS STRUCTURES WITH INTERCONNECTS AND VIAS
- Publication number 20180086627
- Publication date Mar 29, 2018
- Intel Corporation
- Kevin LAI LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO PICK AND BOND ASSEMBLY
- Publication number 20170278733
- Publication date Sep 28, 2017
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC NANOMECHANICAL DEVICES FOR STICTION COMPENSATION
- Publication number 20170158501
- Publication date Jun 8, 2017
- Intel Corporation
- Jorge A. MUNOZ
- B82 - NANO-TECHNOLOGY
Information Patent Application
NANOWIRE-BASED MECHANICAL SWITCHING DEVICE
- Publication number 20160329438
- Publication date Nov 10, 2016
- Chytra Pawashe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYNTHETIC JET DELIVERING CONTROLLED FLOW TO SENSOR SYSTEM
- Publication number 20160171869
- Publication date Jun 16, 2016
- Intel Corporation
- Jessica Gullbrand
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Application
NANOWIRE-BASED MECHANICAL SWITCHING DEVICE
- Publication number 20140262707
- Publication date Sep 18, 2014
- Chytra Pawashe
- B82 - NANO-TECHNOLOGY

Chytra PAWASHE

Person

Patents Grantslast 30 patents

Stress compensation for wafer to wafer bonding

Reducing in-plane distortion from wafer to wafer bonding using a du...

Semiconductor fin design to mitigate fin collapse

Fluid viscosity control during wafer bonding

Display including an LED element having a pressure sensitive adhesi...

Wafer to wafer bonding with low wafer distortion

Compliant layer for wafer to wafer bonding

Integrating MEMS structures with interconnects and vias

Synthetic jet delivering controlled flow to sensor system

Micro pick and bond assembly

Micro pick and bond assembly

Nanowire-based mechanical switching device

Magnetic nanomechanical devices for stiction compensation

Nanowire-based mechanical switching device

Patents Applicationslast 30 patents

DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET

SYSTEM AND METHOD FOR REDUCING PELLICLE RUPTURE

THERMAL MANAGEMENT STRUCTURES IN SEMICONDUCTOR DEVICES AND METHODS...

STRESS COMPENSATION FOR WAFER TO WAFER BONDING

SEMICONDUCTOR FIN DESIGN TO MITIGATE FIN COLLAPSE

REDUCING IN-PLANE DISTORTION FROM WAFER TO WAFER BONDING USING A DU...

MICRO PICK AND BOND ASSEMBLY

INTEGRATING MEMS STRUCTURES WITH INTERCONNECTS AND VIAS

MICRO PICK AND BOND ASSEMBLY

MAGNETIC NANOMECHANICAL DEVICES FOR STICTION COMPENSATION

NANOWIRE-BASED MECHANICAL SWITCHING DEVICE

SYNTHETIC JET DELIVERING CONTROLLED FLOW TO SENSOR SYSTEM

NANOWIRE-BASED MECHANICAL SWITCHING DEVICE