Cindy Reidsema Simpson

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for depositing a layer of material on a substrate
- Patent number 7,323,094
- Issue date Jan 29, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metal transistor gate and method of formation
- Patent number 6,686,282
- Issue date Feb 3, 2004
- Motorola, Inc.
- Cindy Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for depositing a layer of material on a substrate
- Patent number 6,500,324
- Issue date Dec 31, 2002
- Motorola, Inc.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure in a semiconductor device and method of form...
- Patent number 6,316,359
- Issue date Nov 13, 2001
- Motorola Inc.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper layer over a semiconductor wafer
- Patent number 6,297,155
- Issue date Oct 2, 2001
- Motorola Inc.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,218,302
- Issue date Apr 17, 2001
- Motorola Inc.
- Gregor Braeckelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for photoselective seeding and metallization of three-dimens...
- Patent number 6,210,781
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Thomas H. Baum
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure in a semiconductor device and method of form...
- Patent number 6,197,688
- Issue date Mar 6, 2001
- Motorola Inc.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for circuitizing through-holes by photo-activated seeding
- Patent number 6,194,785
- Issue date Feb 27, 2001
- International Business Machines Corporation
- Logan Lloyd Simpson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for depositing a layer of material over a substrate
- Patent number 6,174,425
- Issue date Jan 16, 2001
- Motorola, Inc.
- Cindy Reidsema Simpson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for circuitizing through-holes by photo-activated seeding
- Patent number 6,087,258
- Issue date Jul 11, 2000
- International Business Machines Corporation
- Logan Lloyd Simpson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for photoselective seeding and metallization of three-dimens...
- Patent number 6,022,596
- Issue date Feb 8, 2000
- International Business Machines Corp.
- Thomas H. Baum
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for photoselective seeding and metallization of three-dimens...
- Patent number 6,017,613
- Issue date Jan 25, 2000
- International Business Machines Corporation
- Thomas H. Baum
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Process for depositing a layer of material on a substrate and a pla...
- Publication number 20020195347
- Publication date Dec 26, 2002
- Cindy Reidsema Simpson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Cindy Reidsema Simpson

Person

Patents Grantslast 30 patents

Process for depositing a layer of material on a substrate

Plated metal transistor gate and method of formation

Process for depositing a layer of material on a substrate

Interconnect structure in a semiconductor device and method of form...

Method for forming a copper layer over a semiconductor wafer

Method for forming a semiconductor device

Method for photoselective seeding and metallization of three-dimens...

Interconnect structure in a semiconductor device and method of form...

Method for circuitizing through-holes by photo-activated seeding

Process for depositing a layer of material over a substrate

Method for circuitizing through-holes by photo-activated seeding

Method for photoselective seeding and metallization of three-dimens...

Method for photoselective seeding and metallization of three-dimens...

Patents Applicationslast 30 patents

Process for depositing a layer of material on a substrate and a pla...