Cing He Chen

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
System and method to improve package and 3DIC yield in underfill pr...
- Patent number 8,945,983
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hsin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System and Method to Improve Package and 3DIC Yield in Underfill Pr...
- Publication number 20140183760
- Publication date Jul 3, 2014
- Yen-Hsin Liu
- H01 - BASIC ELECTRIC ELEMENTS