Claudia Sgiarovello

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Stress relieving structure for semiconductor device
- Patent number 10,896,887
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Marius Aurel Bodea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 10,580,753
- Issue date Mar 3, 2020
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate having configurable circuit elements
- Patent number 10,340,197
- Issue date Jul 2, 2019
- Infineon Technologies AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 10,269,635
- Issue date Apr 23, 2019
- Infineon Technologies AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 9,899,277
- Issue date Feb 20, 2018
- Infineon Technologies AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit substrate
- Patent number 9,786,568
- Issue date Oct 10, 2017
- Infineon Technologies AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stress Relieving Structure for Semiconductor Device
- Publication number 20190348382
- Publication date Nov 14, 2019
- Marius Aurel Bodea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Stress Relieving Structure
- Publication number 20190348373
- Publication date Nov 14, 2019
- INFINEON TECHNOLOGIES AG
- Marius Aurel Bodea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20190027464
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT SUBSTRATE
- Publication number 20170271216
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170243785
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT SUBSTRATE
- Publication number 20170243794
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170243795
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170242137
- Publication date Aug 24, 2017
- INFINEON TECHNOLOGIES AG
- Claudia Sgiarovello
- G01 - MEASURING TESTING

Claudia Sgiarovello

Person

Patents Grantslast 30 patents

Stress relieving structure for semiconductor device

Method for manufacturing semiconductor devices

Integrated circuit substrate having configurable circuit elements

Integrated circuit substrate and method for manufacturing the same

Integrated circuit substrate and method for manufacturing the same

Method of manufacturing an integrated circuit substrate

Patents Applicationslast 30 patents

Stress Relieving Structure for Semiconductor Device

Semiconductor Device with Stress Relieving Structure

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT SUBSTRATE

INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT SUBSTRATE

INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME