Claudius Feger

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Nanoparticle design for enhanced oil recovery
- Patent number 11,021,646
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Ronaldo Giro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Injection-molded solder (IMS) tool assembly and method of use thereof
- Patent number 10,766,086
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanoparticle design for enhanced oil recovery
- Patent number 10,392,555
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Ronaldo Giro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Trapping at least one microparticle
- Patent number 10,081,015
- Issue date Sep 25, 2018
- International Business Machines Corporation
- Jaione Tirapu Azpiroz
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Microchannel, microfluidic chip and method for processing micropart...
- Patent number 9,962,714
- Issue date May 8, 2018
- International Business Machines Corporation
- Jaione Tirapu Azpiroz
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method and integrated device for analyzing liquid flow and liquid-s...
- Patent number 9,759,643
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Phaedon Avouris
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and integrated device for analyzing liquid flow and liquid-s...
- Patent number 9,310,285
- Issue date Apr 12, 2016
- International Business Machines Corporation
- Phaedon Avouris
- G01 - MEASURING TESTING
Information Patent Grant
No flow underfill or wafer level underfill and solder columns
- Patent number 8,963,340
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer securing structure and method thereof for the protection...
- Patent number 8,938,627
- Issue date Jan 20, 2015
- International Business Machines Corporation
- Stefano S. Oggioni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Forming constant diameter spherical metal balls
- Patent number 8,875,978
- Issue date Nov 4, 2014
- International Business Machines Corporation
- Claudius Feger
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Injection molded solder process for forming solder bumps on substrates
- Patent number 8,820,612
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum extrusion method of manufacturing a thermal paste
- Patent number 8,636,931
- Issue date Jan 28, 2014
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded solder process for forming solder bumps on substrates
- Patent number 8,496,159
- Issue date Jul 30, 2013
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming constant diameter spherical metal balls
- Patent number 8,408,448
- Issue date Apr 2, 2013
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat transfer control structures using thermal phonon spectral overlap
- Patent number 8,178,153
- Issue date May 15, 2012
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible thermal thickening grease
- Patent number 7,981,849
- Issue date Jul 19, 2011
- International Business Machines Corporation
- Claudius Feger
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Chip-level underfill method of manufacture
- Patent number 7,951,648
- Issue date May 31, 2011
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centrifugal method for filing high aspect ratio blind mirco vias po...
- Patent number 7,815,968
- Issue date Oct 19, 2010
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Underfilling with acid-cleavable acetal and ketal epoxy oligomers
- Patent number 7,776,993
- Issue date Aug 17, 2010
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method and system for collecting alignment data from coated chips o...
- Patent number 7,773,220
- Issue date Aug 10, 2010
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physically highly secure multi-chip assembly
- Patent number 7,768,005
- Issue date Aug 3, 2010
- International Business Machines Corporation
- Vincenzo Condorelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnect structure and method using injection molded solder
- Patent number 7,523,852
- Issue date Apr 28, 2009
- International Business Machines Corporation
- Stephen L. Buchwalter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for thermally induced testing of materials und...
- Patent number 7,516,674
- Issue date Apr 14, 2009
- International Business Machines Corporation
- Claudius Feger
- G01 - MEASURING TESTING
Information Patent Grant
Centrifugal method for filing high aspect ratio blind micro vias wi...
- Patent number 7,452,568
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Electrical connecting device and method of forming same
- Patent number 7,442,049
- Issue date Oct 28, 2008
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for remakeable connections to optical waveguides
- Patent number 7,412,134
- Issue date Aug 12, 2008
- International Business Machines Corporation
- Claudius Feger
- G02 - OPTICS
Information Patent Grant
Physically highly secure multi-chip assembly
- Patent number 7,402,442
- Issue date Jul 22, 2008
- International Business Machines Corporation
- Vincenzo Condorelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for remakeable connections to optical waveguides
- Patent number 7,116,865
- Issue date Oct 3, 2006
- International Business Machines Corporation
- Claudius Feger
- G02 - OPTICS
Information Patent Grant
Tamper-responding encapsulated enclosure having flexible protective...
- Patent number 6,929,900
- Issue date Aug 16, 2005
- International Business Machines Corporation
- Donald S. Farquhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bilayer wafer-level underfill
- Patent number 6,924,171
- Issue date Aug 2, 2005
- International Business Machines Corporation
- Stephen L. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NANOPARTICLE DESIGN FOR ENHANCED OIL RECOVERY
- Publication number 20190338181
- Publication date Nov 7, 2019
- International Business Machines Corporation
- Ronaldo Giro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INJECTION-MOLDED SOLDER (IMS) TOOL ASSEMBLY AND METHOD OF USE THEREOF
- Publication number 20190160572
- Publication date May 30, 2019
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOPARTICLE DESIGN FOR ENHANCED OIL RECOVERY
- Publication number 20170174978
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Ronaldo Giro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TRAPPING AT LEAST ONE MICROPARTICLE
- Publication number 20170007996
- Publication date Jan 12, 2017
- International Business Machines Corporation
- Jaione Tirapu Azpiroz
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Application
MICROCHANNEL, MICROFLUIDIC CHIP AND METHOD FOR PROCESSING MICROPART...
- Publication number 20170008009
- Publication date Jan 12, 2017
- International Business Machines Corporation
- Jaione Tirapu Azpiroz
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Application
METHOD AND INTEGRATED DEVICE FOR ANALYZING LIQUID FLOW AND LIQUID-S...
- Publication number 20160139019
- Publication date May 19, 2016
- International Business Machines Corporation
- Phaedon Avouris
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND INTEGRATED DEVICE FOR ANALYZING LIQUID FLOW AND LIQUID-S...
- Publication number 20160091405
- Publication date Mar 31, 2016
- International Business Machines Corporation
- Phaedon Avouris
- G01 - MEASURING TESTING
Information Patent Application
NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS
- Publication number 20150147851
- Publication date May 28, 2015
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS
- Publication number 20150147846
- Publication date May 28, 2015
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING CONSTANT DIAMETER SPHERICAL METAL BALLS
- Publication number 20140262113
- Publication date Sep 18, 2014
- International Business Machines Corporation
- CLAUDIUS FEGER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
No Flow Underfill or Wafer Level Underfill and Solder Columns
- Publication number 20130062757
- Publication date Mar 14, 2013
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES
- Publication number 20120305631
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES
- Publication number 20120305633
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SECURING STRUCTURE AND METHOD THEREOF FOR THE PROTECTION...
- Publication number 20120117666
- Publication date May 10, 2012
- International Business Machines Corporation
- Stefano S. Oggioni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP CARRIER BEARING LARGE SILICON FOR HIGH PERFORMANCE COMPUTING A...
- Publication number 20100164030
- Publication date Jul 1, 2010
- International Business Machines Corporation
- Stefano S. Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-LEVEL UNDERFILL PROCESS AND STRUCTURES THEREOF
- Publication number 20100003786
- Publication date Jan 7, 2010
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR COLLECTING ALIGNMENT DATA FROM COATED CHIPS O...
- Publication number 20090251698
- Publication date Oct 8, 2009
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly Method For Reworkable Chip Stacking With Conductive Film
- Publication number 20090181476
- Publication date Jul 16, 2009
- International Business Machines Corporation
- Stephen L. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN
- Publication number 20090108472
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Marks on the Edge of Wafers and Methods for Same
- Publication number 20090102070
- Publication date Apr 23, 2009
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR REMAKEABLE CONNECTIONS TO OPTICAL WAVEGU...
- Publication number 20090080833
- Publication date Mar 26, 2009
- Claudius Feger
- G02 - OPTICS
Information Patent Application
CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...
- Publication number 20090032962
- Publication date Feb 5, 2009
- International Business Machines Corporation (Yorktown)
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM EXTRUSION METHOD OF MANUFACTURING A THERMAL PASTE
- Publication number 20080284052
- Publication date Nov 20, 2008
- IBM CORPORATION (YORKTOWN)
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Marks for the Alignment of Wafer-Level Underfilled Silicon Chips an...
- Publication number 20080265445
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICALLY HIGHLY SECURE MULTI-CHIP ASSEMBLY
- Publication number 20080231311
- Publication date Sep 25, 2008
- International Business Machines Corp.
- VINCENZO CONDORELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE THERMAL THICKENING GREASE
- Publication number 20080220998
- Publication date Sep 11, 2008
- IBM CORPORATION (YORKTOWN)
- Claudius Feger
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Application
Heat transfer control structures using thermal phonon spectral overlap
- Publication number 20070230135
- Publication date Oct 4, 2007
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Physically highly secure multi-chip assembly
- Publication number 20070138657
- Publication date Jun 21, 2007
- International Business Machines Corporation
- Vincenzo Condorelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and methods for remakeable connections to optical waveguides
- Publication number 20070025669
- Publication date Feb 1, 2007
- Claudius Feger
- G02 - OPTICS
Information Patent Application
Electrical connecting device and method of forming same
- Publication number 20070004239
- Publication date Jan 4, 2007
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- H01 - BASIC ELECTRIC ELEMENTS

Claudius Feger

Person

Patents Grantslast 30 patents

Nanoparticle design for enhanced oil recovery

Injection-molded solder (IMS) tool assembly and method of use thereof

Nanoparticle design for enhanced oil recovery

Trapping at least one microparticle

Microchannel, microfluidic chip and method for processing micropart...

Method and integrated device for analyzing liquid flow and liquid-s...

Method and integrated device for analyzing liquid flow and liquid-s...

No flow underfill or wafer level underfill and solder columns

Multilayer securing structure and method thereof for the protection...

Forming constant diameter spherical metal balls

Injection molded solder process for forming solder bumps on substrates

Vacuum extrusion method of manufacturing a thermal paste

Injection molded solder process for forming solder bumps on substrates

Forming constant diameter spherical metal balls

Heat transfer control structures using thermal phonon spectral overlap

Reversible thermal thickening grease

Chip-level underfill method of manufacture

Centrifugal method for filing high aspect ratio blind mirco vias po...

Underfilling with acid-cleavable acetal and ketal epoxy oligomers

Method and system for collecting alignment data from coated chips o...

Physically highly secure multi-chip assembly

Solder interconnect structure and method using injection molded solder

Method and apparatus for thermally induced testing of materials und...

Centrifugal method for filing high aspect ratio blind micro vias wi...

Electrical connecting device and method of forming same

Apparatus and methods for remakeable connections to optical waveguides

Physically highly secure multi-chip assembly

Apparatus and methods for remakeable connections to optical waveguides

Tamper-responding encapsulated enclosure having flexible protective...

Bilayer wafer-level underfill

Patents Applicationslast 30 patents

NANOPARTICLE DESIGN FOR ENHANCED OIL RECOVERY

INJECTION-MOLDED SOLDER (IMS) TOOL ASSEMBLY AND METHOD OF USE THEREOF

NANOPARTICLE DESIGN FOR ENHANCED OIL RECOVERY

TRAPPING AT LEAST ONE MICROPARTICLE

MICROCHANNEL, MICROFLUIDIC CHIP AND METHOD FOR PROCESSING MICROPART...

METHOD AND INTEGRATED DEVICE FOR ANALYZING LIQUID FLOW AND LIQUID-S...

METHOD AND INTEGRATED DEVICE FOR ANALYZING LIQUID FLOW AND LIQUID-S...

NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS

NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS

FORMING CONSTANT DIAMETER SPHERICAL METAL BALLS

No Flow Underfill or Wafer Level Underfill and Solder Columns

INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES

INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES

MULTILAYER SECURING STRUCTURE AND METHOD THEREOF FOR THE PROTECTION...

CHIP CARRIER BEARING LARGE SILICON FOR HIGH PERFORMANCE COMPUTING A...

CHIP-LEVEL UNDERFILL PROCESS AND STRUCTURES THEREOF

METHOD AND SYSTEM FOR COLLECTING ALIGNMENT DATA FROM COATED CHIPS O...

Assembly Method For Reworkable Chip Stacking With Conductive Film

WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN

Alignment Marks on the Edge of Wafers and Methods for Same

APPARATUS AND METHODS FOR REMAKEABLE CONNECTIONS TO OPTICAL WAVEGU...

CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...

VACUUM EXTRUSION METHOD OF MANUFACTURING A THERMAL PASTE

Marks for the Alignment of Wafer-Level Underfilled Silicon Chips an...

PHYSICALLY HIGHLY SECURE MULTI-CHIP ASSEMBLY

REVERSIBLE THERMAL THICKENING GREASE

Heat transfer control structures using thermal phonon spectral overlap

Physically highly secure multi-chip assembly

Apparatus and methods for remakeable connections to optical waveguides

Electrical connecting device and method of forming same