Claus Reitlinger

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Wolnzach, DE

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Patents Grantslast 30 patents

Information Patent Grant
Package comprising a substrate, an integrated device, and an encaps...
- Patent number 11,605,571
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Alberto Jose Teixeira De Queiros
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package comprising an enhanced electromagnetic s...
- Patent number 10,438,901
- Issue date Oct 8, 2019
- QUALCOMM Incorporated
- Anna Katharina Krefft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module package and production method
- Patent number 9,576,870
- Issue date Feb 21, 2017
- EPCOS AG
- Claus Reitlinger
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for producing a plurality of electronic devices
- Patent number 9,386,734
- Issue date Jul 5, 2016
- EPCOS AG
- Claus Reitlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAP...
- Publication number 20210375707
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Alberto Jose TEIXEIRA DE QUEIROS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND METHOD FOR PRODUCING A PLURALITY OF MODULES
- Publication number 20190164892
- Publication date May 30, 2019
- SnapTrack, Inc.
- Andreas FRANZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINE...
- Publication number 20130343006
- Publication date Dec 26, 2013
- EPCOS AG
- Claus Reitlinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PLURALITY OF ELECTRONIC DEVICES HAVING ELECT...
- Publication number 20130170172
- Publication date Jul 4, 2013
- EPCOS AG
- Claus Reitlinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE PACKAGE AND PRODUCTION METHOD
- Publication number 20130168876
- Publication date Jul 4, 2013
- EPCOS AG
- Claus Reitlinger
- H01 - BASIC ELECTRIC ELEMENTS