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Claus von Waechter
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Sinzing, DE
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Patents Grants
last 30 patents
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Patent Grant
Bonded system and a method for adhesively bonding a hygroscopic mat...
Patent number
10,332,814
Issue date
Jun 25, 2019
Infineon Technologies AG
Claus Von Waechter
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...
Publication number
20160247739
Publication date
Aug 25, 2016
INFINEON TECHNOLOGIES AG
Claus Von Waechter
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method for Handling a Product Substrate, a Bonded Substrate System...
Publication number
20160218039
Publication date
Jul 28, 2016
INFINEON TECHNOLOGIES AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS