Clay Arrington

Person

Queen Creek, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
- Publication number 20250220818
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...
- Publication number 20250218960
- Publication date Jul 3, 2025
- Intel Corporation
- Clay Bradley Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...
- Publication number 20250218999
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...
- Publication number 20250219028
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218964
- Publication date Jul 3, 2025
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE BOND-DEBOND PROCESSES AND APPARATUSES
- Publication number 20250210398
- Publication date Jun 26, 2025
- Intel Corporation
- Clay ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D FILLERS FOR REDUCED CTE FOR PID
- Publication number 20240332125
- Publication date Oct 3, 2024
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CON...
- Publication number 20240270929
- Publication date Aug 15, 2024
- Intel Corporation
- Clay Arrington
- B82 - NANO-TECHNOLOGY

Clay Arrington

Person

Patents Applicationslast 30 patents

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...

METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...

PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...

DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE

PATTERNABLE BOND-DEBOND PROCESSES AND APPARATUSES

2D FILLERS FOR REDUCED CTE FOR PID

CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CON...