Clem H. Brown

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with mechanical stress isolation of semicondu...
- Patent number 7,821,117
- Issue date Oct 26, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Clem H. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making dual gauge leadframe
- Patent number 7,033,866
- Issue date Apr 25, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having first surface area for electrically...
- Patent number 6,949,816
- Issue date Sep 27, 2005
- Motorola, Inc.
- Clem H. Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual gauge leadframe
- Patent number 6,917,097
- Issue date Jul 12, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential pressure sensor and method thereof
- Patent number 6,148,673
- Issue date Nov 21, 2000
- Motorola, Inc.
- Clem H. Brown
- G01 - MEASURING TESTING
Information Patent Grant
Small outline optocoupler package method
- Patent number 5,677,245
- Issue date Oct 14, 1997
- Motorola, Inc.
- Clem H. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optocoupler package and method for making
- Patent number 5,545,893
- Issue date Aug 13, 1996
- Motorola, Inc.
- Clem H. Brown
- G02 - OPTICS
Information Patent Grant
Dual channel small outline optocoupler package and method thereof
- Patent number 5,489,800
- Issue date Feb 6, 1996
- Motorola, Inc.
- Clem H. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor with stress isolation platform hermetically sealed...
- Patent number 5,465,626
- Issue date Nov 14, 1995
- Motorola, Inc.
- Clem H. Brown
- G01 - MEASURING TESTING
Information Patent Grant
Hermetically sealed pressure sensor and method thereof
- Patent number 5,454,270
- Issue date Oct 3, 1995
- Motorola, Inc.
- Clem H. Brown
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor package for reducing stress-induced measurement error
- Patent number 5,438,877
- Issue date Aug 8, 1995
- Motorola, Inc.
- David L. Vowles
- G01 - MEASURING TESTING
Information Patent Grant
Dual absolute pressure sensor and method thereof
- Patent number 5,437,189
- Issue date Aug 1, 1995
- Motorola, Inc.
- Clem H. Brown
- G01 - MEASURING TESTING
Information Patent Grant
Optocoupler package wth integral voltage isolation barrier
- Patent number 5,340,993
- Issue date Aug 23, 1994
- Motorola, Inc.
- John E. Salina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optocoupler apparatus with reflective overcoat
- Patent number 5,150,438
- Issue date Sep 22, 1992
- Motorola, Inc.
- Clem H. Brown
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
- Publication number 20090261482
- Publication date Oct 22, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Clem H. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual gauge leadframe
- Publication number 20050121756
- Publication date Jun 9, 2005
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual gauge leadframe
- Publication number 20050012183
- Publication date Jan 20, 2005
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component for electrical coupling to a substrate, and...
- Publication number 20040207054
- Publication date Oct 21, 2004
- MOTOROLA, INC.
- Clem H. Brown
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Clem H. Brown

Person

Patents Grantslast 30 patents

Semiconductor package with mechanical stress isolation of semicondu...

Method for making dual gauge leadframe

Semiconductor component having first surface area for electrically...

Dual gauge leadframe

Differential pressure sensor and method thereof

Small outline optocoupler package method

Optocoupler package and method for making

Dual channel small outline optocoupler package and method thereof

Pressure sensor with stress isolation platform hermetically sealed...

Hermetically sealed pressure sensor and method thereof

Pressure sensor package for reducing stress-induced measurement error

Dual absolute pressure sensor and method thereof

Optocoupler package wth integral voltage isolation barrier

Optocoupler apparatus with reflective overcoat

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME

Dual gauge leadframe

Dual gauge leadframe

Semiconductor component for electrical coupling to a substrate, and...