Clemens Fitz

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Aqua regia and hydrogen peroxide HCL combination to remove Ni and N...
- Patent number 9,399,753
- Issue date Jul 26, 2016
- Intermolecular, Inc.
- Anh Duong
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Gate silicidation
- Patent number 9,034,746
- Issue date May 19, 2015
- GLOBALFOUNDRIES Inc.
- Joachim Patzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aqua regia and hydrogen peroxide HCI combination to remove Ni and N...
- Patent number 8,946,015
- Issue date Feb 3, 2015
- Intermolecular, Inc.
- Anh Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate silicidation
- Patent number 8,906,794
- Issue date Dec 9, 2014
- GLOBALFOUNDRIES Inc.
- Joachim Patzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stabilized metal silicides in silicon-germanium regions of transist...
- Patent number 8,859,408
- Issue date Oct 14, 2014
- GLOBALFOUNDRIES Inc.
- Stefan Flachowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
NiSi rework procedure to remove platinum residuals
- Patent number 8,835,298
- Issue date Sep 16, 2014
- GLOBALFOUNDRIES Inc.
- Sivakumar Kumarasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HNO3 single wafer clean process to strip nickel and for MOL post etch
- Patent number 8,835,318
- Issue date Sep 16, 2014
- GLOBALFOUNDRIES Inc.
- Clemens Fitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal silicide regions on semiconductor devices...
- Patent number 8,815,736
- Issue date Aug 26, 2014
- GLOBALFOUNDRIES Inc.
- Thilo Scheiper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aqua regia and hydrogen peroxide HCl combination to remove Ni and N...
- Patent number 8,809,140
- Issue date Aug 19, 2014
- Intermolecular, Inc.
- Anh Duong
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Methods of forming metal silicide regions on semiconductor devices
- Patent number 8,765,586
- Issue date Jul 1, 2014
- GLOBALFOUNDRIES Inc.
- Clemens Fitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for characterizing discontinuities in semicond...
- Patent number 8,761,489
- Issue date Jun 24, 2014
- GLOBALFOUNDRIES Inc.
- Jochen Rinderknecht
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Aqua regia and hydrogen peroxide HCl combination to remove Ni and N...
- Patent number 8,518,765
- Issue date Aug 27, 2013
- Intermolecular, Inc.
- Anh Duong
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Process to remove Ni and Pt residues for NiPtSi applications
- Patent number 8,513,117
- Issue date Aug 20, 2013
- Intermolecular, Inc.
- Anh Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating a CMOS integrated circuit having a dual str...
- Patent number 8,293,605
- Issue date Oct 23, 2012
- GLOBALFOUNDRIES, INC.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with a contact structure including a portion arr...
- Patent number 8,008,729
- Issue date Aug 30, 2011
- Qimonda AG
- Werner Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried bitline with reduced resistance
- Patent number 7,678,654
- Issue date Mar 16, 2010
- Qimonda AG
- Christoph Kleint
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of removing refractory metal layers and of siliciding contac...
- Patent number 7,679,149
- Issue date Mar 16, 2010
- Qimonda AG
- Audrey Beckert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT STRUCTURE WITH SILICIDE REIGON
- Publication number 20180138285
- Publication date May 17, 2018
- GLOBALFOUNDRIES INC.
- Clemens Christof Stefan Fitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and N...
- Publication number 20150105308
- Publication date Apr 16, 2015
- INTERMOLECULAR INC.
- Anh Duong
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
GATE SILICIDATION
- Publication number 20150044861
- Publication date Feb 12, 2015
- GLOBALFOUNDRIES INC.
- Joachim Patzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing voids caused by trapped acid on a dielectric surface
- Publication number 20150017456
- Publication date Jan 15, 2015
- INTERMOLECULAR INC.
- Anh Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and N...
- Publication number 20140363944
- Publication date Dec 11, 2014
- Anh Duong
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
MICROWAVE-ASSISTED HEATING OF STRONG ACID SOLUTION TO REMOVE NICKEL...
- Publication number 20140248770
- Publication date Sep 4, 2014
- GLOBALFOUNDRIES INC.
- Clemens FITZ
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and N...
- Publication number 20130323890
- Publication date Dec 5, 2013
- GLOBALFOUNDRIES, INC.
- Anh Duong
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
HNO3 SINGLE WAFER CLEAN PROCESS TO STRIP NICKEL AND FOR MOL POST ETCH
- Publication number 20130234335
- Publication date Sep 12, 2013
- GLOBALFOUNDRIES INC.
- Clemens Fitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NISI REWORK PROCEDURE TO REMOVE PLATINUM RESIDUALS
- Publication number 20130234213
- Publication date Sep 12, 2013
- GLOBALFOUNDRIES INC.
- Sivakumar KUMARASAMY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Metal Silicide Regions on Semiconductor Devices
- Publication number 20130157450
- Publication date Jun 20, 2013
- GLOBALFOUNDRIES INC.
- Clemens Fitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS TO REMOVE Ni AND Pt RESIDUES FOR NiPtSi APPLICATIONS
- Publication number 20130122671
- Publication date May 16, 2013
- GLOBALFOUNDRIES
- Anh Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CHARACTERIZING DISCONTINUITIES IN SEMICOND...
- Publication number 20130058559
- Publication date Mar 7, 2013
- GLOBALFOUNDRIES INC.
- Jochen Rinderknecht
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Methods of Forming Metal Silicide Regions on Semiconductor Devices...
- Publication number 20130052819
- Publication date Feb 28, 2013
- GLOBALFOUNDRIES INC.
- Thilo Scheiper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSFET INTEGRATED CIRCUIT WITH IMPROVED SILICIDE THICKNESS UNIFORMI...
- Publication number 20130049124
- Publication date Feb 28, 2013
- GLOBALFOUNDRIES INC.
- Clemens Fitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stabilized Metal Silicides in Silicon-Germanium Regions of Transist...
- Publication number 20120261725
- Publication date Oct 18, 2012
- GLOBALFOUNDRIES INC.
- Stefan Flachowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING A CMOS INTEGRATED CIRCUIT HAVING A DUAL STR...
- Publication number 20120220086
- Publication date Aug 30, 2012
- GLOBALFOUNDRIES INC.
- Peter Baars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with a Contact Structure Including a Portion Arr...
- Publication number 20100090285
- Publication date Apr 15, 2010
- QIMONDA AG
- Werner Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACK INCLUDING A TUNGSTEN LAYER
- Publication number 20090236682
- Publication date Sep 24, 2009
- Hocine Boubekeur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating an Integrated Circuit
- Publication number 20090057810
- Publication date Mar 5, 2009
- Victor Verdugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method for an integrated circuit structure
- Publication number 20080124920
- Publication date May 29, 2008
- Clemens Fitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Removing Refractory Metal Layers and of Siliciding Contac...
- Publication number 20080029835
- Publication date Feb 7, 2008
- Qimonda AG
- Audrey Beckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried bitline with reduced resistance
- Publication number 20080002466
- Publication date Jan 3, 2008
- Christoph Kleint
- G11 - INFORMATION STORAGE

Clemens Fitz

Person

Patents Grantslast 30 patents

Aqua regia and hydrogen peroxide HCL combination to remove Ni and N...

Gate silicidation

Aqua regia and hydrogen peroxide HCI combination to remove Ni and N...

Gate silicidation

Stabilized metal silicides in silicon-germanium regions of transist...

NiSi rework procedure to remove platinum residuals

HNO3 single wafer clean process to strip nickel and for MOL post etch

Methods of forming metal silicide regions on semiconductor devices...

Aqua regia and hydrogen peroxide HCl combination to remove Ni and N...

Methods of forming metal silicide regions on semiconductor devices

Method and apparatus for characterizing discontinuities in semicond...

Aqua regia and hydrogen peroxide HCl combination to remove Ni and N...

Process to remove Ni and Pt residues for NiPtSi applications

Methods for fabricating a CMOS integrated circuit having a dual str...

Integrated circuit with a contact structure including a portion arr...

Buried bitline with reduced resistance

Method of removing refractory metal layers and of siliciding contac...

Patents Applicationslast 30 patents

METHODS OF FORMING INTEGRATED CIRCUIT STRUCTURE WITH SILICIDE REIGON

Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and N...

GATE SILICIDATION

Reducing voids caused by trapped acid on a dielectric surface

Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and N...

MICROWAVE-ASSISTED HEATING OF STRONG ACID SOLUTION TO REMOVE NICKEL...

Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and N...

HNO3 SINGLE WAFER CLEAN PROCESS TO STRIP NICKEL AND FOR MOL POST ETCH

NISI REWORK PROCEDURE TO REMOVE PLATINUM RESIDUALS

Methods of Forming Metal Silicide Regions on Semiconductor Devices

PROCESS TO REMOVE Ni AND Pt RESIDUES FOR NiPtSi APPLICATIONS

METHOD AND APPARATUS FOR CHARACTERIZING DISCONTINUITIES IN SEMICOND...

Methods of Forming Metal Silicide Regions on Semiconductor Devices...

MOSFET INTEGRATED CIRCUIT WITH IMPROVED SILICIDE THICKNESS UNIFORMI...

Stabilized Metal Silicides in Silicon-Germanium Regions of Transist...

METHODS FOR FABRICATING A CMOS INTEGRATED CIRCUIT HAVING A DUAL STR...

Integrated Circuit with a Contact Structure Including a Portion Arr...

LAYER STACK INCLUDING A TUNGSTEN LAYER

Method of Fabricating an Integrated Circuit

Fabrication method for an integrated circuit structure

Method of Removing Refractory Metal Layers and of Siliciding Contac...

Buried bitline with reduced resistance