Cliff Lee

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic substrate for alternate package functionality
- Patent number 9,961,769
- Issue date May 1, 2018
- Intel Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic substrate for alternate package functionality
- Patent number 8,674,235
- Issue date Mar 18, 2014
- Intel Corporation
- Md Altaf Hossain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus to boost high-speed I/O signal performance usi...
- Patent number 7,356,796
- Issue date Apr 8, 2008
- Intel Corporation
- Cliff Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERFACE STRUCTURES FOR PACKAGED CIRCUITRY AND METHOD OF PROVIDING...
- Publication number 20180005972
- Publication date Jan 4, 2018
- Intel Corporation
- Md Altaf HOSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC SUBSTRATE FOR ALTERNATE PACKAGE FUNCTIONALITY
- Publication number 20140133075
- Publication date May 15, 2014
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC SUBSTRATE FOR ALTERNATE PACKAGE FUNCTIONALITY
- Publication number 20120305303
- Publication date Dec 6, 2012
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Routing density through asymmetric array of vias
- Publication number 20080150122
- Publication date Jun 26, 2008
- Cliff Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus to boost high-speed I/O signal performance usi...
- Publication number 20060292739
- Publication date Dec 28, 2006
- Cliff Lee
- H01 - BASIC ELECTRIC ELEMENTS