CLIFFORD IAN DROWLEY

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Thin-film bulk acoustic resonator and semiconductor apparatus compr...
- Patent number 11,575,358
- Issue date Feb 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package structure
- Patent number 11,562,980
- Issue date Jan 24, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package structure
- Patent number 11,450,582
- Issue date Sep 20, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure
- Patent number 10,978,421
- Issue date Apr 13, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level system-in-package packaging method and package structur...
- Patent number 10,910,286
- Issue date Feb 2, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside processed semiconductor device
- Patent number 10,910,274
- Issue date Feb 2, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure thereof
- Patent number 10,861,822
- Issue date Dec 8, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure thereof
- Patent number 10,804,177
- Issue date Oct 13, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure thereof
- Patent number 10,790,211
- Issue date Sep 29, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure and wafer level packaging method
- Patent number 10,784,229
- Issue date Sep 22, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level system packaging method and package structure
- Patent number 10,756,051
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonator and related manufacturing method
- Patent number 10,700,663
- Issue date Jun 30, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Manufacturing of thin-film bulk acoustic resonator and semiconducto...
- Patent number 10,693,431
- Issue date Jun 23, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of thin-film bulk acoustic resonator and semiconducto...
- Patent number 10,686,422
- Issue date Jun 16, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Resonator and related manufacturing method
- Patent number 10,511,284
- Issue date Dec 17, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device, related manufacturing method, and related ele...
- Patent number 10,433,435
- Issue date Oct 1, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transistor and method for forming the same
- Patent number 10,199,478
- Issue date Feb 5, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried-channel MOSFET and a surface-channel MOSFET of a same type a...
- Patent number 10,062,704
- Issue date Aug 28, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Tzu Yin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, related manufacturing method, and related ele...
- Patent number 9,978,763
- Issue date May 22, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside processed semiconductor device
- Patent number 9,953,877
- Issue date Apr 24, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor and fabrication method thereof
- Patent number 9,947,709
- Issue date Apr 17, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-side process silicon MOS and passive devices for RF front-en...
- Patent number 9,711,502
- Issue date Jul 18, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit and manufacturing method thereof
- Patent number 9,691,667
- Issue date Jun 27, 2017
- SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION (SHANGHAI)
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator substrate and method of manufacturing thereof
- Patent number 9,607,880
- Issue date Mar 28, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with radio frequency (RF) switches and co...
- Patent number 9,589,884
- Issue date Mar 7, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, related manufacturing method, and related ele...
- Patent number 9,553,097
- Issue date Jan 24, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, related manufacturing method, and related ele...
- Patent number 9,449,950
- Issue date Sep 20, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a closed cavity structure and method of...
- Patent number 9,397,116
- Issue date Jul 19, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-side process silicon MOS and passive devices for RF front-en...
- Patent number 9,147,598
- Issue date Sep 29, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE
- Publication number 20210082869
- Publication date Mar 18, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE
- Publication number 20200402876
- Publication date Dec 24, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM BULK ACOUSTIC RESONATOR AND SEMICONDUCTOR APPARATUS COMPR...
- Publication number 20200280294
- Publication date Sep 3, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM BULK ACOUSTIC RESONATOR AND SEMICONDUCTOR APPARATUS COMPR...
- Publication number 20200266790
- Publication date Aug 20, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF
- Publication number 20200075444
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF
- Publication number 20200075536
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL SYSTEM-IN-PACKAGE PACKAGING METHOD AND PACKAGE STRUCTUR...
- Publication number 20200075442
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL SYSTEM PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20200075538
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE STRUCTURE AND WAFER LEVEL PACKAGING METHOD
- Publication number 20200075539
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20200075537
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF
- Publication number 20200075443
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE PROCESSED SEMICONDUCTOR DEVICE
- Publication number 20180204776
- Publication date Jul 19, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- HERB HE HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM BULK ACOUSTIC RESONATOR, SEMICONDUCTOR APPARATUS COMPRISI...
- Publication number 20170264263
- Publication date Sep 14, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONATOR AND RELATED MANUFACTURING METHOD
- Publication number 20170264265
- Publication date Sep 14, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THIN-FILM BULK ACOUSTIC RESONATOR, SEMICONDUCTOR APPARATUS COMPRISI...
- Publication number 20170264264
- Publication date Sep 14, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED-CHANNEL MOSFET AND A SURFACE-CHANNEL MOSFET OF A SAME TYPE A...
- Publication number 20170194339
- Publication date Jul 6, 2017
- Semiconductor Manufacturing International (Beijing) Corporation
- Tzu Yin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR AND FABRICATION METHOD THEREOF
- Publication number 20170170224
- Publication date Jun 15, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- HERB HE HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONATOR AND RELATED MANUFACTURING METHOD
- Publication number 20170170806
- Publication date Jun 15, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...
- Publication number 20170117286
- Publication date Apr 27, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR AND METHOD FOR FORMING THE SAME
- Publication number 20170104084
- Publication date Apr 13, 2017
- Semiconductor Manufacturing International (Beijing) Corporation
- HERB HE HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE PROCESS SILICON MOS AND PASSIVE DEVICES FOR RF FRONT-EN...
- Publication number 20170053907
- Publication date Feb 23, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...
- Publication number 20160381811
- Publication date Dec 29, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKSIDE PROCESSED SEMICONDUCTOR DEVICE
- Publication number 20160204035
- Publication date Jul 14, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- HERB HE HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE PROCESS SILICON MOS AND PASSIVE DEVICES FOR RF FRONT-EN...
- Publication number 20150368095
- Publication date Dec 24, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- HERB HE HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...
- Publication number 20150294956
- Publication date Oct 15, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...
- Publication number 20150214236
- Publication date Jul 30, 2015
- Semiconduntor Manufacturing International (Shangha i) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20150214296
- Publication date Jul 30, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND RELATED MANUFACTURING METHOD
- Publication number 20150214221
- Publication date Jul 30, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20150187639
- Publication date Jul 2, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...
- Publication number 20150187793
- Publication date Jul 2, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He HUANG
- H01 - BASIC ELECTRIC ELEMENTS

CLIFFORD IAN DROWLEY

Person

Patents Grantslast 30 patents

Thin-film bulk acoustic resonator and semiconductor apparatus compr...

Wafer-level package structure

Wafer-level package structure

Wafer-level packaging method and package structure

Wafer-level system-in-package packaging method and package structur...

Backside processed semiconductor device

Wafer-level packaging method and package structure thereof

Wafer-level packaging method and package structure thereof

Wafer-level packaging method and package structure thereof

Wafer level package structure and wafer level packaging method

Wafer-level system packaging method and package structure

Resonator and related manufacturing method

Manufacturing of thin-film bulk acoustic resonator and semiconducto...

Manufacturing of thin-film bulk acoustic resonator and semiconducto...

Resonator and related manufacturing method

Semiconductor device, related manufacturing method, and related ele...

Transistor and method for forming the same

Buried-channel MOSFET and a surface-channel MOSFET of a same type a...

Semiconductor device, related manufacturing method, and related ele...

Backside processed semiconductor device

CMOS image sensor and fabrication method thereof

Double-side process silicon MOS and passive devices for RF front-en...

Integrated circuit and manufacturing method thereof

Silicon-on-insulator substrate and method of manufacturing thereof

Integrated circuit device with radio frequency (RF) switches and co...

Semiconductor device, related manufacturing method, and related ele...

Semiconductor device, related manufacturing method, and related ele...

Semiconductor device having a closed cavity structure and method of...

Double-side process silicon MOS and passive devices for RF front-en...

Patents Applicationslast 30 patents

WAFER-LEVEL PACKAGE STRUCTURE

WAFER-LEVEL PACKAGE STRUCTURE

THIN-FILM BULK ACOUSTIC RESONATOR AND SEMICONDUCTOR APPARATUS COMPR...

THIN-FILM BULK ACOUSTIC RESONATOR AND SEMICONDUCTOR APPARATUS COMPR...

WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF

WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF

WAFER-LEVEL SYSTEM-IN-PACKAGE PACKAGING METHOD AND PACKAGE STRUCTUR...

WAFER-LEVEL SYSTEM PACKAGING METHOD AND PACKAGE STRUCTURE

WAFER LEVEL PACKAGE STRUCTURE AND WAFER LEVEL PACKAGING METHOD

WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE

WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF

BACKSIDE PROCESSED SEMICONDUCTOR DEVICE

THIN-FILM BULK ACOUSTIC RESONATOR, SEMICONDUCTOR APPARATUS COMPRISI...

RESONATOR AND RELATED MANUFACTURING METHOD

THIN-FILM BULK ACOUSTIC RESONATOR, SEMICONDUCTOR APPARATUS COMPRISI...

BURIED-CHANNEL MOSFET AND A SURFACE-CHANNEL MOSFET OF A SAME TYPE A...

CMOS IMAGE SENSOR AND FABRICATION METHOD THEREOF

RESONATOR AND RELATED MANUFACTURING METHOD

SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...

TRANSISTOR AND METHOD FOR FORMING THE SAME

DOUBLE-SIDE PROCESS SILICON MOS AND PASSIVE DEVICES FOR RF FRONT-EN...

SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...

BACKSIDE PROCESSED SEMICONDUCTOR DEVICE

DOUBLE-SIDE PROCESS SILICON MOS AND PASSIVE DEVICES FOR RF FRONT-EN...

SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...

SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT DEVICE AND RELATED MANUFACTURING METHOD

SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELE...