Clifford M. Howard

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a bond pad
- Patent number 5,814,893
- Issue date Sep 29, 1998
- Motorola Inc.
- Ting-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a semiconductor device having a bond pad
- Patent number 5,661,082
- Issue date Aug 26, 1997
- Motorola, Inc.
- Ting-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS