Clifford Sandstrom

Person

Richfield, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fully molded structure with multi-height components comprising back...
- Patent number 12,300,561
- Issue date May 13, 2025
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 12,170,261
- Issue date Dec 17, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with through silicon...
- Patent number 12,057,373
- Issue date Aug 6, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 11,973,051
- Issue date Apr 30, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) package without leadframe and direct contac...
- Patent number 11,749,534
- Issue date Sep 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded semiconductor structure with through silicon via (TSV)...
- Patent number 11,728,248
- Issue date Aug 15, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step high aspect ratio vertical interconnect and method of ma...
- Patent number 11,664,321
- Issue date May 30, 2023
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with through silicon...
- Patent number 11,616,003
- Issue date Mar 28, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded bridge interposer and method of making the same
- Patent number 11,538,759
- Issue date Dec 27, 2022
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded semiconductor structure with face mounted passives and...
- Patent number 11,444,051
- Issue date Sep 13, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...
- Publication number 20250112141
- Publication date Apr 3, 2025
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
- Publication number 20250054785
- Publication date Feb 13, 2025
- Deca Technologies USA, Inc.
- Benedict SAN JOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...
- Publication number 20240421017
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH VERTICA...
- Publication number 20240395673
- Publication date Nov 28, 2024
- Deca Technologies USA, Inc.
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED MOLDED DIRECT CONTACT AND DIELECTRIC STRUCTURE AND METHOD F...
- Publication number 20240243089
- Publication date Jul 18, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...
- Publication number 20240213202
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND DIRECT CONTAC...
- Publication number 20240030113
- Publication date Jan 25, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITH BACKSIDE CONDUCTIVE MATERIAL A...
- Publication number 20240030174
- Publication date Jan 25, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...
- Publication number 20230411333
- Publication date Dec 21, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...
- Publication number 20230387060
- Publication date Nov 30, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...
- Publication number 20230378029
- Publication date Nov 23, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...
- Publication number 20230238304
- Publication date Jul 27, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20230142384
- Publication date May 11, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...
- Publication number 20230005819
- Publication date Jan 5, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...
- Publication number 20230005820
- Publication date Jan 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...
- Publication number 20220352106
- Publication date Nov 3, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP HIGH ASPECT RATIO VERTICAL INTERCONNECT AND METHOD OF MA...
- Publication number 20220246532
- Publication date Aug 4, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20220238445
- Publication date Jul 28, 2022
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...
- Publication number 20220173067
- Publication date Jun 2, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS

Clifford Sandstrom

Person

Patents Grantslast 30 patents

Fully molded structure with multi-height components comprising back...

Molded direct contact interconnect structure without capture pads a...

Stackable fully molded semiconductor structure with through silicon...

Molded direct contact interconnect structure without capture pads a...

Quad flat no-lead (QFN) package without leadframe and direct contac...

Fully molded semiconductor structure with through silicon via (TSV)...

Multi-step high aspect ratio vertical interconnect and method of ma...

Stackable fully molded semiconductor structure with through silicon...

Fully molded bridge interposer and method of making the same

Fully molded semiconductor structure with face mounted passives and...

Patents Applicationslast 30 patents

QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...

METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH VERTICA...

LAYERED MOLDED DIRECT CONTACT AND DIELECTRIC STRUCTURE AND METHOD F...

ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...

QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND DIRECT CONTAC...

QUAD FLAT NO-LEAD (QFN) PACKAGE WITH BACKSIDE CONDUCTIVE MATERIAL A...

MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...

MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...

FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...

MULTI-STEP HIGH ASPECT RATIO VERTICAL INTERCONNECT AND METHOD OF MA...

FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...