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last 30 patents
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Patent Grant
Multi-die IC package and manufacturing method
Patent number
7,816,775
Issue date
Oct 19, 2010
United Test & Assembly Center Limited
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Multi-Die Ic Package and Manufacturing Method
Publication number
20080150103
Publication date
Jun 26, 2008
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS