Clint Thomas

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Compact high density plasma source
- Patent number 12,198,896
- Issue date Jan 14, 2025
- Lam Research Corporation
- Roger Patrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluid handling system for wafer electroless plating and associated...
- Patent number 8,844,461
- Issue date Sep 30, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for removing contamination from substrate
- Patent number 8,555,903
- Issue date Oct 15, 2013
- Lam Research Corporation
- Erik M. Freer
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus and system for cleaning a substrate
- Patent number 8,522,799
- Issue date Sep 3, 2013
- Lam Research Corporation
- Erik M. Freer
- B08 - CLEANING
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 8,485,120
- Issue date Jul 16, 2013
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,314,027
- Issue date Nov 20, 2012
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,069,813
- Issue date Dec 6, 2011
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for removing contamination from substrate
- Patent number 7,648,584
- Issue date Jan 19, 2010
- Lam Research Corporation
- Erik M. Freer
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

Patents Applicationslast 30 patents

Information Patent Application
FAST ATOMIC LAYER ETCH
- Publication number 20250210363
- Publication date Jun 26, 2025
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST
- Publication number 20230314954
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Daniel PETER
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPARATUS FOR PHOTORESIST DRY DEPOSITION
- Publication number 20220308462
- Publication date Sep 29, 2022
- LAM RESEARCH CORPORATION
- Butch Berney
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
COMPACT HIGH DENSITY PLASMA SOURCE
- Publication number 20210183619
- Publication date Jun 17, 2021
- LAM RESEARCH CORPORATION
- Roger Patrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Systems for Cleaning A Substrate
- Publication number 20150040947
- Publication date Feb 12, 2015
- LAM RESEARCH CORPORATION
- Erik M. Freer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20130280917
- Publication date Oct 24, 2013
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20120045897
- Publication date Feb 23, 2012
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Removing Contamination from Substrate
- Publication number 20100059088
- Publication date Mar 11, 2010
- LAM RESEARCH CORPORATION
- Erik M. Freer
- B08 - CLEANING
Information Patent Application
APPARATUS AND SYSTEM FOR CLEANING A SUBSTRATE
- Publication number 20090308413
- Publication date Dec 17, 2009
- LAM RESEARCH CORPORATION
- Erik M. Freer
- B08 - CLEANING
Information Patent Application
Fluid Handling System for Wafer Electroless Plating and Associated...
- Publication number 20080251148
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20080254621
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20080254225
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for removing contamination from substrate
- Publication number 20070079848
- Publication date Apr 12, 2007
- LAM RESEARCH CORPORATION
- Erik M. Freer
- B08 - CLEANING

Clint Thomas

Person

Patents Grantslast 30 patents

Compact high density plasma source

Method and apparatus for wafer electroless plating

Fluid handling system for wafer electroless plating and associated...

Method and apparatus for removing contamination from substrate

Apparatus and system for cleaning a substrate

Method and apparatus for wafer electroless plating

Wafer electroless plating system and associated methods

Wafer electroless plating system and associated methods

Method and apparatus for removing contamination from substrate

Patents Applicationslast 30 patents

FAST ATOMIC LAYER ETCH

DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST

APPARATUS FOR PHOTORESIST DRY DEPOSITION

COMPACT HIGH DENSITY PLASMA SOURCE

Method and Systems for Cleaning A Substrate

Method and Apparatus for Wafer Electroless Plating

Wafer Electroless Plating System and Associated Methods

Method and Apparatus for Removing Contamination from Substrate

APPARATUS AND SYSTEM FOR CLEANING A SUBSTRATE

Fluid Handling System for Wafer Electroless Plating and Associated...

Wafer Electroless Plating System and Associated Methods

Method and Apparatus for Wafer Electroless Plating

Method and apparatus for removing contamination from substrate